Philips TEA5880TS - page 24

9397 750 13022 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.

Preliminary data sheet Rev. 02 — 26 April 2004 24 of 27

Philips Semiconductors TEA5880TS

Integrated FM stereo radio IC for host processor tuning

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. Thepackage footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger

than 0.65mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mountedon ﬂex foil. However, the image sensor package can be mounted by the client ona ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

Contents

Main 1. General description 2. Features TEA5880TS Rev. 02 26 April 2004 Preliminary data sheet Integrated FM stereo radio IC for host processor tuning in handheld applications 3. Quick reference data V = V 4. Ordering information V = V Preliminary data sheet Rev. 02 26 April 2004 4 of 27 TEA5880TS 5. Block diagram Philips Semiconductors TEA5880TS TEA5880TS Fig 2. Block diagram (no external components). 6. Pinning information 6.1 Pin description Preliminary data sheet Rev. 02 26 April 2004 7 of 27 TEA5880TS 7. Functional description Fig 3. Pin conguration. 7.1 FM quadrature mixer The digital interface controls the audio mute and output level. 7.2 Quadrature oscillator 8. Digital interface (3-wire bus) 8.1 Register description Page Page Page 8.2 Accessing the TEA5880TS 8.3 Writing to the TEA5880TS 8.4 Reading from the TEA5880TS 8.5 Measuring frequency with the TEA5880TS 9. Timing diagrams Fig 6. Reading data. Fig 7. Measuring sequence. 10. Limiting values 11. Thermal characteristics 12. Characteristics In accordance with the Absolute Maximum Rating System (IEC 60134). 13. Components list No external components necessary. (1) Mono signal. (2) Mono noise. (3) Stereo left. (4) Stereo right. (5) Stereo noise. Fig 9. Total harmonic distortion. Fig 8. Signal characteristics. 14. Printed-circuit board layout for SSOP24 package Preliminary data sheet Rev. 02 26 April 2004 20 of 27 15. Application information TEA5880FM (1) optional. Fig 11. Application diagram. 16. Package outline Fig 12. Package outline. SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 17. Soldering 17.1 Introduction to soldering surface mount packages Data Handbook IC26; Integrated Circuit Packages 17.2 Reow soldering 17.3 Wave soldering Page Page Preliminary data sheet Rev. 02 26 April 2004 26 of 27 19. Data sheet status 20. Denitions 21. Disclaimers 22. Contact information 23. Contents