Renesas M30200T-RPD-E - page 5

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Chapter 6. External Dimensions........................................................................................... 25

Chapter 7. Maintenance and Warranty................................................................................. 27

7.1 Maintenance ........................................................................................................27

7.2 Warranty.............................................................................................................. 27

7.3 Repair Provisions ................................................................................................27

7.4 How to Request for Repair.................................................................................. 28

Chapter 8. Troubleshooting ..................................................................................................29

Contents

Main ( 2 / 32 ) Preface To use the product properly Precautions for Safety: Contents Page Summary Terminology Things to Check When Unpacking Other tool products required for this product: Chapter 1. Precautions for Safety WARNING IMPORTANT CAUTION WARNING Warning for Installation: CAUTION Caution to be Taken for Modifying This Product: Cautions to be Taken for This Product: Notes on the Target System: Notes on PC4701 Emulator Main Units: Note on Abnormal Operation of PC4701 System: Page Notes on MAP References and Settings: Note on Differences between Actual MCU and Emulator: Note on Address 0 Access: Note on Referencing and Setting the Work Area: Note on Changing Settings of the Memory Area: Page Chapter 2. Introduction Chapter 3. Specifications Table 3.1 lists the specifications of M30200T-RPD-E. Table 3.1 Specifications of M30200T-RPD-E Page 4.2 Setting Oscillation Frequency Page Page Page Page Page 5.3 Connection to the Pod Probe Caution Note on Connecting the Cable: Page Page Chapter 7. Maintenance and Guarantee 7.1 Maintenance 7.2 Guarantee 7.3 Repair Provisions 7.4 How to Request for Repair CAUTION Note on Transporting the Product: Chapter 8. Troubleshooting