Datasheet
Chapter 11 Package Outline
Figure 11.1 - 64 Pin TQFP Package Outline, 10 x 10 x 1.4 Body, 2 MM Footprint
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| Table 11.1 - 64 Pin TQFP Package Parameters | ||
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| MIN | NOMINAL | MAX | REMARKS |
A | ~ | ~ | 1.60 | Overall Package Height |
A1 | 0.05 | ~ | 0.15 | Standoff |
A2 | 1.35 | ~ | 1.45 | Body Thickness |
D | 11.80 | ~ | 12.20 | X Span |
D1 | 9.80 | ~ | 10.20 | X body Size |
E | 11.80 | ~ | 12.20 | Y Span |
E1 | 9.80 | ~ | 10.20 | Y body Size |
H | 0.09 | ~ | 0.20 | Lead Frame Thickness |
L | 0.45 | 0.60 | 0.75 | Lead Foot Length |
L1 | ~ | 1.00 | ~ | Lead Length |
e |
| 0.50 Basic |
| Lead Pitch |
θ | 0o | ~ | 7o | Lead Foot Angle |
W | 0.17 | 0.22 | 0.27 | Lead Width |
R1 | 0.08 | ~ | ~ | Lead Shoulder Radius |
R2 | 0.08 | ~ | 0.20 | Lead Foot Radius |
ccc | ~ | ~ | 0.08 | Coplanarity |
Notes:
1.Controlling Unit: millimeter.
2.Tolerance on the true position of the leads is ± 0.04 mm maximum.
3.Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm per side.
4.Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5.Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC USB20H04 | Page 35 | Revision 1.63 |
DATASHEET