4-Port USB 2.0 Controller

Datasheet

Chapter 11 Package Outline

Figure 11.1 - 64 Pin TQFP Package Outline, 10 x 10 x 1.4 Body, 2 MM Footprint

 

 

Table 11.1 - 64 Pin TQFP Package Parameters

 

 

 

 

 

 

MIN

NOMINAL

MAX

REMARKS

A

~

~

1.60

Overall Package Height

A1

0.05

~

0.15

Standoff

A2

1.35

~

1.45

Body Thickness

D

11.80

~

12.20

X Span

D1

9.80

~

10.20

X body Size

E

11.80

~

12.20

Y Span

E1

9.80

~

10.20

Y body Size

H

0.09

~

0.20

Lead Frame Thickness

L

0.45

0.60

0.75

Lead Foot Length

L1

~

1.00

~

Lead Length

e

 

0.50 Basic

 

Lead Pitch

θ

0o

~

7o

Lead Foot Angle

W

0.17

0.22

0.27

Lead Width

R1

0.08

~

~

Lead Shoulder Radius

R2

0.08

~

0.20

Lead Foot Radius

ccc

~

~

0.08

Coplanarity

Notes:

1.Controlling Unit: millimeter.

2.Tolerance on the true position of the leads is ± 0.04 mm maximum.

3.Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm per side.

4.Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5.Details of pin 1 identifier are optional but must be located within the zone indicated.

SMSC USB20H04

Page 35

Revision 1.63 (03-30-07)

DATASHEET