6.2 Block Diagram - Baseband

MCP-I/F

BL-I/F

FLASH/SRAM

KEY-I/F

LCD-I/F

LCD

IC 1

I/O CONNECTOR

1DGND

2

CHG

 

 

 

MODEM -I/F

JOG-I/F

 

 

3

 

 

 

 

GEN I/O

 

 

 

 

4POWER OUT

5

RX (IN)

TIME

 

 

6

TX (OUT)

PROCCESSING

 

AUDIO

 

 

UNIT

 

7

ACC ID

 

AMP

 

 

 

 

 

8

RTS

RTC

32kHz

 

9

CTS

RF-I/F

 

CLK-

10

AUDIO OUT

 

CTRL

 

SIM

 

 

11

AUDIO IN

 

 

12

AGND

Interface

IC 2

 

 

 

 

I/F

 

Battery

 

IC 1

 

Connector

Power / CHG

I/F

 

KEY-LED

LCD-LED

KEY-MATRIX

KEYBOARD

JOG

RINGER

HEADSET

AUDIO &

REMOTE

MIC

FLEX-BOARD

SLIDE-SW (REC/LOCK or Manner)

JOG DIAL

Multiactor

*Ringer

*Vibrator *Loud- Speaker

HEADPHONE-JACK

Management

LI-ION

 

 

 

 

BATTERY

 

 

SIM I/F

 

AUDIO

 

 

 

 

 

 

 

 

I/F

 

 

 

 

RTC / ID

HFK I/F

IC 2

 

SIM

 

SIM LEVEL

 

CTRL 3V/5V

Connector

 

 

 

A/D CONV

RF I/F

A/D, D/A

SIM CARD

RF TCXO

BLOCK

AUDIO

EAR

AMP

RECEIVER

 

MIC

6.2.1 General Baseband Indications

The Baseband part consists of two chips, a digital chip IC 1 and an analog one IC 2. The CMD-J5/J16 external memory size is 32 Mbits Flash ROM and 4 Mbit SRAM.

IC 1

The application of IC 1 is the management of the GSM baseband processes through the GSM layer 1, 2 and 3 protocols as described in the ETSI standard with a specific attention to the power consumption in both GSM dedicated and idle modes.

It is a chip that implements:

the digital baseband processes of the CMD-J5/J16 and combines a Digital Signal Processing (DSP) with its program and data memories,

a Micro-Controller core with emulation facilities and an internal RAM memory, a clock squarer cell,

several compiled ports and equivalent CMOS gates.

Full support for Full-Rate, Enhanced Full-Rate and Half-Rate speech coding is given.

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Sony CMD-J5/J16 specifications Block Diagram Baseband, General Baseband Indications