Sony MZ-E707 service manual Ver, Ic Block Diagrams, IC901 XPC18A32FCR2, Waveforms, 1 TE, J Digital

MZ-E707

Ver 1.1 2001.12

Note on Printed Wiring Boards: MAIN SECTION

•X : parts extracted from the component side.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:
Pattern face side:	Parts on the pattern face side seen from the
(Side B)	pattern face are indicated.
Parts face side:	Parts on the parts face side seen from the
(Side A)	parts face are indicated.

•Main boards is four-layer pritnted board.

However, the patterns of layer 2 and 3 have not been included in this diagrams.

•Replacement of IC601 used in this set requires a special tool.

•Lead Layouts

surface

Lead layout of	CSP (chip size package)
conventional IC

Note on Schematic Diagram: MAIN SECTION

•All capacitors are in ∝ F unless otherwise noted. pF: ∝∝ F 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•f : internal component.

Note: The components identified by mark 0or dotted line with mark 0are critical for safety.

Replace only with part number specified.

• : B+ Line.

•Power voltage is dc 1.5V and fed with regulated dc power supply from battery terminal.

•Voltages and waveforms are dc with respect to ground under no-signal conditions.

no mark : PLAY

•Voltages are taken with a VOM (Input impedance 10 MΩ ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path. F : Analog

J : Digital

•Replacement of IC601 used in this set requires a special tool.

•The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different form that of conventional IC.

MAIN BOARD SUB ASSY • IC BLOCK DIAGRAMS

• Audio board is supplied with main board sub ASSY.

• Audio board can not be moved away from main bord.

IC901 XPC18A32FCR2

Give a damage when take it off forcibly.

• The part that audio board overlap with main board can not

be repaired.

VAFB

VDFB

VIFFB

GND

VCO

VCOUT

PGND1

PGND1

VIF

VA

VC

VC

L1

NC

42

41

40

39

38

37

36

35

34

33

32

31

30

29

•

WAVEFORMS

1

NC

43

VG

VG

VG

28

L1

SERIAL PASS

POWER

STEP-UP

STEP-UP

27

REGULATOR VA

RF1

VD 44

SWITCH 1

PRE DRIVEER

PRE DRIVEER

SERIAL PASS

Approx.

REGULATOR VD

12 mVp-p

VC2

45

SERIAL PASS

INM1

26

REGULATOR VIF

IC501

1 TE

XRST (INT)

VC

25

DTC1

XRST

46

VC

VC

2

PWM

24

DTC2

CRST 47

VC

RSTREF

48

23

RF2

Approx.

VC

1.2 Vp-p

BANDGAP

VREF

49

22

INM2

REFERENCE

VC

VG

IC501

ed

(RF)

VB

50

21

PWM1

VC

VG

GND

20

PWM2

3

51

VSTB

VC

VB

VB VC VG

VG

CLKSEL

52

19

VG

Approx.

VAIFON

53

VB

STEP-UP

10 mVp-p

FFCLR

54

18

LG

START-UP

DC/DC

SLEEP

55

CONTROL

CONVERTOR

IC501

rs

(FE)

CLK

56

17

PGND2

VSTB

VG

PWER

STEP-UP

16

L2

PRE DRIVEER

SWITCH 2

VC

VB

15

NC

1

2

3

4

5

6

7

8

9

10

11

12

13

14

VLON

XWK1

XWK2

XWK3

XWK4

VSTV

VRMC

GND

VL

VLO

VL

L2

PGND2

PGND2

24 24