Sony MZ-R50 service manual

Battery operation time

See “Battery life”

Battery life

Batteries	Recording	Playback
LIP-8 lithium ion	Approx.	Approx.
Rechargeable battery	4 hours	7 hours
Two LR6 (size AA)		Approx.
Sony alkaline dry batteries		12 hours
LIP-8 + Two LR6 (size AA)		Approx.
		22 hours

Dimensions

Approx. 109.5 x 19.7 x 77 mm (w/h/d) (4 3/8 x 25/32 x 3 1/8 in.)

Mass

Approx. 190 g (6.8 oz) the recorder only Approx. 240 g (8.5 oz) incl, a recordable MD, and LIP-8 lithium ion rechargeable battery Supplied accessories

AC power adaptor (1)

Headphones with a remote control (1) LIP-8 lithium ion rechargeable battery (1) Dry battery case (1)

Ear pads (2) Carrying case (1)

Design and specifications are subject to change without notice.

For customers in Europe

This MiniDisc Recorder is classified as a CLASS 1 LASER product.

The CLASS 1 LASER PRODUCT label is located on the buttom exterior.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK !OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS

LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

	TABLE OF CONTENTS
Specifications		1
1.	SERVICING NOTE	3
2.	GENERAL
	Location and Function of Controls	4
3.	DISASSEMBLY
	3-1. Upper Panel Assy, Bottom Panel Assy Removal	20
	3-2. Main Board Removal	21
	3-3. Mechanism Deck (MT-MZR50-143) Removal	21
	3-4. Optical Pick-up Assy, REC Board Removal	22
	3-5. CLV Board Removal	22
	3-6. Battery Case Assy Removal	23
	3-7. Power Board, Switch Board Removal	23
	3-8. Switch Unit (with JOG Dial) Removal	24
4.	TEST MODE	25
5.	ADJUSTMENTS	31
6.	DIAGRAMS
	6-1. Explanation of IC Terminals	35
	6-2. Block Diagrams	39
	6-3. Circuit Boards Location	43
	6-4. Printed Wiring Boards – Main Section –	45
	6-5. Schematic Diagram – Main (1/3) Section –	49
	6-6. Schematic Diagram – Main (2/3) Section –	53
	6-7. Schematic Diagram – Main (3/3) Section –	57
7.	EXPLODED VIEWS
	7-1. Upper Panel, Bottom Panel Section	65
	7-2. Chassis Section	66
	7-3. Mechanism Deck Section	67
8.	ELECTRICAL PARTS LIST	68

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270°C during repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be damaged by heat.

ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE !SUR LES

DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

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