73M2901/5V Advanced Single Chip Modem

DESCRIPTION

The 73M2901/5V is a single-chip modem that
combines all the controller (DTE) and data pump
functions necessary to implement an intelligent
V.22bis data modem. This device is based on TDK
Semiconductor’s implementation of the industry
standard 8032 microcontroller core with a proprietary
multiply and accumulate (MAC) coprocessor; Sigma-
Delta A/D and D/A converters; and an analog front
end. The ROM and RAM necessary to operate the
modem are contained on the device. Additionally,
the 73M2901/5V provides an on-chip oscillator and
Hybrid driver.
The 73M2901/5V is a high performance, low
voltage, low power, single chip modem capable of
data transmission and reception through 2400bps.
The 73M2901/5V is intended for embedded
applications and battery operation. This device
offers options for a low power conventional 5 volt
design with optional internal hybrid and country
specific call progress support.

FEATURES

· Low overall system chip count. True one
chip solution for embedded systems
· Low operating power (~250mW @ 5V,
automatic low power standby and power
down options available)
· Internal ROM and RAM for normal operation
· On chip optional hybrid driver
· Designed for +5 volts (+/-10%)
· Data speeds:
V.22bis 2400bps
V.22, Bell 212 1200bps
V.21, Bell 103 300bps
V.23 1200/75bps (w/ turnaround (PAVI))
Bell 202 1200bps
Bell 202 and V23 4-wire operations
· Dynamic Range: -9dBm to 43 dBm
· “AT” command set
· Host access to modem port pins via AT
commands for custom I/O expansion
· DTMF tone generation and detection
· Call progress support with multinational
options (FCC68, CTR21, JATE…)
· Caller ID capability
· Blacklisting capability
· Packaging: 32 pin PLCC or 44 pin TQFP
BLOCK DIAGRAM
ROM
MAC
RAM

CPU

AFE

Hybrid RxA
TxAP
TxAP
HBDEN
TxCLK
ASRCH
RING
DTR
RI
CTS
DCD
DSR
RTS
RxCLK
TxD
RxD
USR10
USR11
RELAY
August 2001
TDK SEMICONDUCTOR CORP.
®