TDK specifications Multilayer Chip Diplexers For GSM850/GSM900/DCS/PCS

Multilayer Chip Diplexers

For GSM850/GSM900/DCS/PCS

DPX Series DPX161990DT-8003B1

SHAPES AND DIMENSIONS

	1.6±0.15 0.6±0.1
	6	5	4	0.8±0.15	Terminal functions
1		2	3
				1		GND
0.55±0.1			0.3±0.1
					2	ANT

3GND

4HIGH

5GND

6LOW

0.1±0.1 0.25±0.1 Dimensions in mm

CIRCUIT DIAGRAM

6 5 4

1 2 3

RECOMMENDED PC BOARD PATTERNS

0.7

0.7	Lo-port	Hi-port
		ø0.15 Through-hole
	0.15 0.4	Dimensions in mm
	Ant-port

This width is 50Ω.

Micro-strip line for 0.4mm thick glass-epoxy substrate.

(1/2)

Conformity to RoHS Directive

ELECTRICAL CHARACTERISTICS

Item	Port	Frequency range		Minimum value	Typical value	Maximum value
Insertion loss	Lo-band	824 to 960MHz	(dB)	—	—	0.7
	Hi-band	1710 to 1990MHz	(dB)	—	—	0.85
Return loss	ANT	824 to 960MHz	(dB)	10.0	—	—
	ANT	1710 to 1990MHz	(dB)	10.0	—	—
Attenuation	Hi-band	824 to 960MHz	(dB)	17.0	—	—
	Lo-band	1710 to 1990MHz	(dB)	15.0	—	—
Temperature range		Operating	(°C)	–40	—	+85
		Storage	(°C)	–40	—	+85

• Ta:+25°C

•Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

•All specifications are subject to change without notice.

001-02 / 20080112 / e741_dpx161990dt.fm