Data Sheet: PoweretaTM iQP Series –Single Output Quarter Brick

Thermal Management:

An important part of the overall system design process is thermal management; thermal design must be considered at all levels to ensure good reliability and lifetime of the final system. Superior thermal design and the ability to operate in severe application environments are key elements of a robust, reliable power module.

A finite amount of heat must be dissipated from the power module to the surrounding environment. This heat is transferred by the

The cross section of the airflow passage is rectangular with the spacing between the top of the module and a parallel facing PCB kept at a constant (0.5 in). The power module’s orientation with respect to the airflow direction can have a significant impact on the unit’s thermal performance.

Thermal Derating: For proper application of the power module in a given thermal environment, output current derating curves are provided as a design guideline in the

three modes of heat transfer: convection, conduction and radiation. While all three modes of heat transfer are present in every application, convection is the dominant mode of heat transfer in most applications. However, to ensure adequate cooling and proper operation, all three modes should be considered in a final system configuration.

The open frame design of the power module provides an air path to individual components. This air path improves convection cooling to the surrounding environment, which reduces areas of heat concentration and resulting hot spots.

Test Setup: The thermal performance data of the power module is based upon measurements obtained from a wind tunnel test with the setup shown in the wind tunnel figure. This thermal test setup replicates the typical thermal environments encountered in most modern electronic systems with distributed power architectures. The electronic equipment in networking, telecom,

Module

Centerline

76 (3.0)

AIRFLOW

Air Velocity and Ambient

Temperature

Measurement Location

Adjacent PCB

A

 

 

12.7

 

 

I

 

 

(0.50)

R

 

 

 

 

 

F

 

 

 

L

 

 

 

O

 

 

 

W

 

 

 

 

 

 

 

 

 

 

 

Air Passage

Centerline

wireless, and advanced computer systems operates in similar environments and utilizes vertically mounted printed circuit boards (PCBs) or circuit cards in cabinet racks.

The power module is mounted on a 0.062 inch thick, 6-layer, 2oz/layer PCB and is vertically oriented within the wind tunnel. Power is routed on the internal layers of the PCB. The outer copper layers are thermally decoupled from the converter to better simulate the customer’s application. This also results in a more conservative derating.

Wind Tunnel Test Setup Figure

Dimensions are in millimeters and (inches).

Thermal Performance section for the power module of interest. The module temperature should be measured in the final system configuration to ensure proper thermal management of the power module. For thermal performance verification, the module temperature should be measured at the component indicated in the thermal measurement location figure on the thermal

©2006 TDK Innoveta Inc.

℡ (877) 498-0099

9/15

iQP 3.3V/70A Datasheet 8/3/2006

 

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TDK iQP48070A033 manual Thermal Management, Wind Tunnel Test Setup Figure
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iQP48070A033 specifications

The TDK iQP48070A033 is a versatile power module designed for high-performance applications requiring efficient and reliable power management. Known for its compact form factor and robust performance, this module is ideal for various electronic devices, including telecommunications equipment, industrial machinery, and consumer electronics.

One of the main features of the iQP48070A033 is its high efficiency. This power module offers an efficiency rating of up to 95%, ensuring minimal energy loss during operation. This not only translates to reduced energy costs but also promotes higher system reliability by minimizing heat generation. The module is designed to handle a wide input voltage range, typically from 36V to 75V, making it suitable for various power supply scenarios.

The iQP48070A033 employs advanced technology to ensure optimal performance and reliability. It includes built-in over-voltage protection, under-voltage lockout, and over-current protection features. These safety mechanisms are crucial for preventing damage to sensitive electronic components when unexpected power conditions arise. Additionally, the power module also features thermal shutdown capability, which protects against overheating in high-load situations.

Another notable characteristic of this module is its compact size, which is vital for modern electronic devices where space can be limited. Its dimensions allow for easy integration into existing systems without compromising on performance. Furthermore, the iQP48070A033 is designed for ease of use, with a straightforward layout that simplifies the design process for engineers and developers.

The TDK iQP48070A033 also boasts a wide operating temperature range, typically from -40°C to +125°C, ensuring its reliability in various environmental conditions. This feature makes it an excellent choice for industries where temperature fluctuations are common, such as automotive and aerospace applications.

Overall, the TDK iQP48070A033 power module stands out for its high efficiency, robust safety features, compact design, and broad operating temperature range. It is a reliable choice for engineers seeking a dependable power solution that can meet the demands of modern electronic applications while maintaining energy efficiency and performance.
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