Texas Instruments HPL-D SLLU064A manual PCB Fabrication Requirements and Stack Up

3.3 PCB Fabrication Requirements and Stack Up

Notes:

1.PWB TO BE FABRICATED TO MEET OR EXCEED IPC-6012, CLASS 3 STANDARDS AND WORKMANSHIP SHALL CONFORM TO IPC-A-600, CLASS 3 CURRENT REVISIONS

2.BOARD MATERIAL AND CONSTRUCTION TO BE UL APPROVED AND MARKED ON THE FINISHED BOARD.

3.LAMINATE MATERIAL:COPPER-CLAD NELCO N4000-13 (DO NOT USE -13SI)

4.COPPER WEIGHT: 1oz FINISHED

5.FINISHED THICKNESS: 0.062" +/- 0.010"

6.MIN PLATING THICKNESS IN THROUGH HOLES: .001"

7.SMOBC / HASL

8.LPI SOLDERMASK BOTH SIDES USING APPROPRIATE LAYER ARTWORK: COLOR = GREEN

9.LPI SILKSCREEN AS REQUIRED: COLOR = WHITE

10.VENDOR INFORMATION TO BE INCORPORATED ON BACK SIDE WHENEVER POSSIBLE

11.MINIMUM COPPER CONDUCTOR WIDTH IS: 0.009"

MINIMUM CONDUCTOR SPACING IS: 0.006"

12.NUMBER OF FINISHED LAYERS: 6

13.ALL 8 MIL HOLES TO BE PLUGGED AND COPLANAR TO SURFACE

14.SPACING BETWEEN LAYERS 1 AND 2 SHOULD BE 0.0075" SPACING BETWEEN LAYERS 2 AND 3 SHOULD BE 0.0075" SPACING BETWEEN LAYERS 4 AND 5 SHOULD BE 0.0075" SPACING BETWEEN LAYERS 5 AND 6 SHOULD BE 0.0075"

Stackup

Signal: Layer 1

0.0075"

GND: Layer 2

0.0075"

VCC Power: Layer 3 0.062"

VCCO1 Power: Layer 4

0.0075"

GND: Layer 5

0.0075"

SIGNAL/GND: Layer 6

3-8