The TPA6011A4 Audio Power Amplifier Evaluation Module

Figure 3–3. TPA6011A4 EVM Schematic Diagram

ROUT–

GND

 

 

1

 

 

 

C11

C10

2

 

10

F

0.47

F

 

 

 

3

C1

0.47F

ROUT+

PGND

ROUT– SE/BTL HP/LINE

PVDD

24

ROUT+

VDD

 

J1

R1

 

23

100 k

SE/BTL

22

J3

 

HP/LINE

J2

R2

 

100 k

R HP

4

RHPIN VOLUME

21 VDD

VOLUME

C2

0.47 F

VDD

R LINE–

5

RLINEIN SEDIFF

20

C3

0.47 F

VDD

R IN

6

RINSEMAX

19

C7VDD

0.47 F

7

C4

0.47 F

VDDAGND

VDD

 

18

GND

 

C8

0.47

F

L IN

8

LINBYPASS

17

C5

0.47 F

VDD

J4

L LINE–

9

LLINEIN

R3

C6

0.47F

L HP

10

 

VDD

11

 

C9

F 12

0.47

FADE

LHPIN SHUTDOWN

PVDD

LOUT+

LOUT–

PGND

16

100 k

 

 

FADE

15

 

 

SDZ

 

 

 

S1

R4

 

100 k

 

 

14

 

VDD

 

LOUT+

 

 

13

 

GND

 

 

LOUT–

3.2.1TPA6011A4 Audio Amplifier IC

The TPA6011A4 audio amplifier IC (see Figure 3–4) is a CMOS device intended primarily for bridge-tied load (BTL) operation in battery-powered applications. It is supplied in a very small 24-pin TSSOP thermal surface-mount package designed to operate from low supply voltages (between approximately 4.5 V and 5.5 V). Typical applications include portable computers and multimedia systems.

The IC includes two separate amplifier channels, each of which can operate in either the bridged-tied load (BTL) mode or the single-ended mode as selected by the SE/BTL pin. In the BTL mode, the line inputs are automatically selected and the two output lines of each channel operate as mirror images of each other for increased power. The speaker load is connected directly across OUT+ and OUT–, and neither line is connected to ground. BTL operation provides many benefits, including quadruple the output power of single-ended operation and no need for bulky output coupling capacitors.

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Details

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Image 24
Texas Instruments SLOU121 manual TPA6011A4 EVM Schematic Diagram, 1 TPA6011A4 Audio Amplifier IC

SLOU121 specifications

Texas Instruments SLOU121 is a comprehensive technical document that serves as a guide for the evaluation and implementation of various TI products. This document highlights the operational capabilities, design considerations, and practical applications of TI’s semiconductor solutions, with a focus on enabling engineers and designers to optimize their designs effectively.

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