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Texas Instruments THS4503EVM manual Trademarks

Models: THS4503EVM

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Trademarks

-Application report (literature number SLMA002), Power Pad Thermally Enhanced Package, http://www−s.ti.com/sc/psheets/slma004/slma002.pdf

-Application report (literature number SLMA004), Power Pad Made Easy, http://www−s.ti.com/sc/psheets/slma004/slma004.pdf

-Application report (literature number SSYA008), Electrostatic Discharge (ESD), http://www−s.ti.com/sc/psheets/ssya008/ssya008.pdf

Trademarks

PowerPAD is a trademark of Texas Instruments.

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Texas Instruments THS4503EVM manual Trademarks

Contents

SLOU132 User’s GuideTHS4503EVM JuneIMPORTANT NOTICE EVM IMPORTANT NOTICE EVM WARNINGS AND RESTRICTIONS Preface How to Use This ManualAbout This Manual Information About Cautions and WarningsElectrostatic Sensitive Components FCC WarningRelated Documentation From Texas Instruments Trademarks Page 1 Introduction and Description 1−1. Schematic of the Populated Circuit on the EVM Default Configuration Page ChapterTopic 1.1 Description 1.2 Evaluation Module Features1.3THS4503EVM Operating Conditions EVM Default Configuration 1.4 EVM Default ConfigurationIntroduction and Description Page Topic Using the THS4503EVMChapter PageFigure 2−1. Power Supply Connection for ±5 Vdc 2.2Power Supply Connection Refer to Figure 2−12.1Required Equipment 2.4Signal Connection VIN− Refer to Figure 2−2 2.3 Function Generator SetupFigure 2−2. Signal Connections Page Single-Endedto Fully Differential Application ChapterPage Topic3.2 Single-Endedto Fully Differential Application Single-Endedto Fully Differential Application Figure 3−2. Single Supply OperationTHS4503EVM Applications t − Time − s Volts3 2 1 0 −1 500 nHigh-SpeedAmplifier PCB Layout Tips ChapterCircuit pathways should be made as symmetrical as possible for both feedback pathways to minimize second and other even-harmoniccontent Reference Table 5−1. THS4503EVM Bill of MaterialsChapter EVM Hardware DescriptionDistributor’s Figure 5−1. Top Layer 1 Signals for THS4503EVMReference Manufacturer’sEVM Hardware Description Figure 5−2. Bottom Layer 2 Ground and SignalFigure 5−3. Schematic Diagram