EVM Configuration and Description | www.ti.com |
3.3Board Stack-Up
Table 3 shows the board
Table 3. Board Stack-Up
| Subclass | Type | Thickness | Dielectric | Loss | Shield | Width | Impedance | Coupling | Spacing | Diff Zo |
| Name | (mils) | Constant | Tangent | (mils) | (Ω) | Type | (mils) | (Ω) | ||
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1 |
| SURFACE |
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2 | TOP | CONDUCTOR | 2.4 | 1 | 0 |
| 7.5 | 47.72 | EDGE | 7.5 | 85.004 |
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3 |
| DIELECTRIC | 4 | 4.1 | 0.035 |
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4 | GND | PLANE | 1.2 | 1 | 0 | YES |
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5 |
| DIELECTRIC | 48 | 4.1 | 0.035 |
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6 | VCC | PLANE | 1.2 | 1 | 0 | YES |
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7 |
| DIELECTRIC | 4 | 4.1 | 0.035 |
| 7.5 | 47.72 | EDGE | 7.5 | 85.004 |
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8 | BOTTOM | CONDUCTOR | 2.4 | 1 | 0 |
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9 |
| SURFACE |
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6 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer | SCDU001A |
Switch Evaluation Module | Submit Documentation Feedback |
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