Philips BGM1012 specifications Package Outline, Plastic surface mounted package 6 leads SOT363

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Philips Semiconductors	Product speciﬁcation

MMIC wideband ampliﬁer	BGM1012

PACKAGE OUTLINE
Plastic surface mounted package; 6 leads	SOT363

D B

y

E

A

X

HE v M A

6

5 4

pin 1 index

1

e1

e

2	3
bp	w M

0

B

Q

A

A1

c

Lp

detail X

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)

	UNIT	A	A1	bp	c	D	E	e	e1	HE	Lp	Q	v	w	y
			max

	mm	1.1	0.1	0.30	0.25	2.2	1.35	1.3	0.65	2.2	0.45	0.25	0.2	0.2	0.1
		0.8		0.20	0.10	1.8	1.15			2.0	0.15	0.15

OUTLINE VERSION

REFERENCES

IEC

JEDEC

EIAJ

EUROPEAN

PROJECTION

ISSUE DATE

SOT363

SC-88

97-02-28

2002 Sep 06

10

Image 10

Contents Data Sheet Applications FeaturesSymbol Parameter Conditions TYP MAX Unit DescriptionThermal Characteristics Symbol Parameter Conditions Symbol Parameter Conditions MINLimiting Values Characteristics Symbol Parameter Conditions MIN TYP MAX UnitMmic wideband ampliﬁer Application InformationInput reflection coefficient s11 typical values Isolation ⎪s 12 ⎪ 2 as a function of frequency Noise figure as a function of frequency Angle Package Outline Plastic surface mounted package 6 leads SOT363Product Definitions STATUS2 Data Sheet StatusDisclaimers Philips Semiconductors a worldwide company