Delta Electronics Series E24SR manual Pick And Place Location, Recommended Pad Layout Smd

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PICK AND PLACE LOCATION

PICK AND PLACE LOCATION

SURFACE-MOUNT TAPE & REEL

RECOMMENDED PAD LAYOUT (SMD)

DS_E24SR05012_01032008

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Image 11

Contents APPLICATIONS FEATURESDATASHEET DSE24SR0501201032008 OPTIONSDYNAMIC CHARACTERISTICS TECHNICAL SPECIFICATIONSINPUT CHARACTERISTICS OUTPUT CHARACTERISTICSELECTRICAL CHARACTERISTICS CURVES For Positive Remote On/Off Logic For Negative Remote On/Off LogicNote Measured input reflected-ripple current with a simulated source Inductance LTEST of 12 μH. Capacitor Cs offset possible battery impedance. Measure current as shown above Figure 12 Input reflected ripple current, is, through a 12µH Input Source Impedance Safety ConsiderationsSoldering and Cleaning Considerations DESIGN CONSIDERATIONSRemote Sense FEATURES DESCRIPTIONSOver-Current Protection Over-Voltage ProtectionRtrim − down = ⎢ FEATURES DESCRIPTIONS CONOutput Voltage Adjustment TRIM Ex. When Trim-down -10% 5V×0.9=0.45VThermal Derating Thermal Testing SetupTHERMAL CONSIDERATIONS THERMAL CURVESSURFACE-MOUNT TAPE & REEL PICK AND PLACE LOCATIONRECOMMENDED PAD LAYOUT SMD Time LEADED Sn/Pb PROCESS RECOMMEND TEMP. PROFILELEAD FREE SAC PROCESS RECOMMEND TEMP. PROFILE TempPin No MECHANICAL DRAWINGSurface-mount module Through-hole moduleMODEL NAME PART NUMBERING SYSTEMMODEL LIST WARRANTYat any time, without notice