Delta Electronics Series E24SR manual Electrical Characteristics Curves

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Note: Measured input reflected-ripple current with a simulated source Inductance (LTEST) of 12 μH. Capacitor Cs offset possible battery impedance. Measure current as shown above

ELECTRICAL CHARACTERISTICS CURVES

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Figure 8: Output voltage response to step-change in load current (75%-50%-75% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF tantalum capacitor and 1µF ceramic capacitor.

Top Trace: Vout (100mV/div, 200us/div), Bottom Trace: Iout (5A/div). Scope measurement should be made using a BNC cable (length shorter than 20 inches). Position the load between 51 mm to 76 mm (2 inches to 3 inches) from the module

Figure 9: Output voltage response to step-change in load current (75%-50%-75% of Io, max; di/dt = 1A/µs). Load cap: 470µF, 35mΩ ESR solid electrolytic capacitor and 1µF ceramic capacitor.

Top Trace: Vout (100mV/div, 200us/div), Bottom Trace: Iout (5A/div). Scope measurement should be made using a BNC cable (length shorter than 20 inches). Position the load between 51 mm to 76 mm (2 inches to 3 inches) from the module

Figure 10: Test set-up diagram showing measurement points for Input Terminal Ripple Current and Input Reflected Ripple Current.

Note: Measured input reflected-ripple current with a simulated source Inductance (LTEST) of 12 μH. Capacitor Cs offset possible battery impedance. Measure current as shown above

Figure 11: Input Terminal Ripple Current, ic, at full rated output current and nominal input voltage with 12µH source impedance and 33µF electrolytic capacitor (200 mA/div, 2us/div)

DS_E24SR05012_01032008

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Contents DATASHEET DSE24SR0501201032008 FEATURESOPTIONS APPLICATIONSINPUT CHARACTERISTICS TECHNICAL SPECIFICATIONSOUTPUT CHARACTERISTICS DYNAMIC CHARACTERISTICSELECTRICAL CHARACTERISTICS CURVES For Positive Remote On/Off Logic For Negative Remote On/Off LogicNote Measured input reflected-ripple current with a simulated source Inductance LTEST of 12 μH. Capacitor Cs offset possible battery impedance. Measure current as shown above Figure 12 Input reflected ripple current, is, through a 12µH Soldering and Cleaning Considerations Safety ConsiderationsDESIGN CONSIDERATIONS Input Source ImpedanceOver-Current Protection FEATURES DESCRIPTIONSOver-Voltage Protection Remote SenseOutput Voltage Adjustment TRIM FEATURES DESCRIPTIONS CONEx. When Trim-down -10% 5V×0.9=0.45V Rtrim − down = ⎢THERMAL CONSIDERATIONS Thermal Testing SetupTHERMAL CURVES Thermal DeratingSURFACE-MOUNT TAPE & REEL PICK AND PLACE LOCATIONRECOMMENDED PAD LAYOUT SMD LEAD FREE SAC PROCESS RECOMMEND TEMP. PROFILE LEADED Sn/Pb PROCESS RECOMMEND TEMP. PROFILETemp TimeSurface-mount module MECHANICAL DRAWINGThrough-hole module Pin NoMODEL LIST PART NUMBERING SYSTEMWARRANTY MODEL NAMEat any time, without notice