Delta Electronics Series E24SR manual Thermal Considerations, Thermal Curves, Thermal Derating

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THERMAL CONSIDERATIONS

THERMAL CONSIDERATIONS

Thermal Derating

Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of heat transfer.

Hence, the choice of equipment to characterize the thermal performance of the power module is a wind tunnel.

Thermal Testing Setup

Heat can be removed by increasing airflow over the module. To enhance system reliability, the power module should always be operated below the maximum operating temperature. If the temperature exceeds the maximum module temperature, reliability of the unit may be affected.

THERMAL CURVES

Delta’s DC/DC power modules are characterized in heated vertical wind tunnels that simulate the thermal environments encountered in most electronics equipment. This type of equipment commonly uses vertically mounted circuit cards in cabinet racks in which the power modules are mounted.

The following figure shows the wind tunnel

 

 

 

 

 

 

 

characterization setup. The power module is mounted

Figure 21:

Hot spot temperature measured point

on a test PWB and is vertically positioned within the

The allowed maximum hot spot temperature is defined at 118

wind tunnel. The space between the neighboring PWB

 

 

 

 

 

 

 

and the top of the power module is constantly kept at

 

 

 

 

 

 

 

6.35mm (0.25’’).

 

 

 

 

 

 

 

 

Output Current(A)

E24SR05012(Standard)

Output Current vs. Ambient Temperature and Air Velocity

 

 

 

 

 

 

 

 

@Vin = 24V (Transverse Orientation)

 

 

 

 

 

 

 

 

 

12

 

 

Natural

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

FACING PWB

 

 

 

 

PWB

10

 

 

Convection

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MODULE

 

 

 

 

 

 

 

 

 

 

 

 

 

8

 

 

 

100LFM

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

200LFM

 

 

 

 

 

 

 

 

 

 

6

 

 

 

 

 

 

AIR VELOCITY

 

 

 

 

 

 

 

 

4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AND AMBIENT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TEMPERATURE

 

 

 

 

 

 

 

 

2

 

 

 

 

 

 

MEASURED BELOW

 

 

 

 

 

50.8 (2.0”)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

THE MODULE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AIR FLOW

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

25 30

35 40 45

50 55 60 65 70 75 80 85

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ambient Temperature ()

 

 

 

 

 

 

 

 

 

Figure 22: Output current vs. ambient temperature and air velocity

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

12.7 (0.5”)

@Vin=24V (Transverse Orientation)

 

 

 

 

 

 

 

Note: Wind Tunnel Test Setup Figure Dimensions are in millimeters and (Inches)

Figure 20: Wind tunnel test setup

DS_E24SR05012_01032008

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Contents OPTIONS FEATURESDATASHEET DSE24SR0501201032008 APPLICATIONSOUTPUT CHARACTERISTICS TECHNICAL SPECIFICATIONSINPUT CHARACTERISTICS DYNAMIC CHARACTERISTICSELECTRICAL CHARACTERISTICS CURVES For Negative Remote On/Off Logic For Positive Remote On/Off LogicNote Measured input reflected-ripple current with a simulated source Inductance LTEST of 12 μH. Capacitor Cs offset possible battery impedance. Measure current as shown above Figure 12 Input reflected ripple current, is, through a 12µH DESIGN CONSIDERATIONS Safety ConsiderationsSoldering and Cleaning Considerations Input Source ImpedanceOver-Voltage Protection FEATURES DESCRIPTIONSOver-Current Protection Remote SenseEx. When Trim-down -10% 5V×0.9=0.45V FEATURES DESCRIPTIONS CONOutput Voltage Adjustment TRIM Rtrim − down = ⎢THERMAL CURVES Thermal Testing SetupTHERMAL CONSIDERATIONS Thermal DeratingRECOMMENDED PAD LAYOUT SMD PICK AND PLACE LOCATIONSURFACE-MOUNT TAPE & REEL Temp LEADED Sn/Pb PROCESS RECOMMEND TEMP. PROFILELEAD FREE SAC PROCESS RECOMMEND TEMP. PROFILE TimeThrough-hole module MECHANICAL DRAWINGSurface-mount module Pin NoWARRANTY PART NUMBERING SYSTEMMODEL LIST MODEL NAMEat any time, without notice