Texas Instruments 5611/13PHD2EVM setup guide Fault Reporting, Additional Documentation

Related Documentation from Texas Instruments www.ti.com

3.2Fault Reporting

The OTW and SD outputs from TAS5611/13 indicate fault conditions. See the TAS5611PHD/TAS5613PHD data manual for a description of these pins.

Table 3. TAS5611/13 Warning/Error Signal Decoding

	SD	OTW1	OTW2	Device Condition
0		0	0	High-temperature error and/or high-current error
0		0	1	Undervoltage lockout or high current error. 100°C
				temperature warning.
0		1	1	Undervoltage lockout or high-current error
1		0	0	125°C temperature warning
1		0	1	100°C temperature warning
1		1	1	Normal operation, no errors/warnings

The shutdown signals together with the temperature warning signal give chip-state information as described in the Table 3. device fault-reporting outputs are open-drain outputs.

4Related Documentation from Texas Instruments

Table 4 contains a list of data manuals that have detailed descriptions of the integrated circuits used in the design of the TAS5611/13PHD2EVM. The data manuals can be obtained at the URL http://www.ti.com.

Table 4. Related Documentation from

Texas Instruments

Part Number	Literature Number
TAS5611	SLAS681
TAS5613	SLAS676
OPA1632D	SBOS286
LM317M	SLVS297
TL2575HV-15I	SLVS638

4.1Additional Documentation

1.System Design Considerations for True Digital Audio Power Amplifiers application report (SLAA117)

2.Digital Audio Measurements application report (SLAA114)

3. PSRR for PurePath Digital™ Audio Amplifiers application report (SLEA049)

4.Power Rating in Audio Amplifiers application report (SLEA047)

5. PurePath Digital™ AM Interference Avoidance application report (SLEA040)

6.Click and Pop Measurements Technique application report (SLEA044)

7.Power Supply Recommendations for DVD-Receivers application report (SLEA027)

8.Implementation of Power Supply Volume Control application report (SLEA038)

Appendix A Design Documents

This appendix comprises design documents pertaining to the TAS5611/13PHD2EVM evaluation module. The documents are presented in the following order.

•Schematic (4 pages)

•Parts List (1 pages)

•PCB Specification (1 page)

•PCB Layers (6 pages)

•Heat-Sink Drawing (1 page)

•Inductor (1 page)

8	Design Documents	SLOU286 –December 2009
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