
Preliminary Information
26237C | AMD Athlon™ XP Processor Model 10 Data Sheet |
10 Mechanical Data
The AMD Athlon™ XP processor model 10 connects to themotherboard through a Pin Grid Array (PGA) socket named Socket A. This processor utilizes the Organic Pin Grid Array (OPGA) package type described in this chapter. For more information, see the AMD Athlon™
10.1Die Loading
The processor die on the OPGA package is exposed at the top of the package. This feature facilitates heat transfer from the die to an approved heat sink. Any heat sink design should avoid loads on corners and edges of die. The OPGA package has compliant pads that serve to bring surfaces in planar contact.
Table 20 shows the mechanical loading specifications for the processor die. It is critical that the mechanical loading of the heat sink does not exceed the limits shown in Table 20.
Table 20. Mechanical Loading
Location | Dynamic (MAX) | Static (MAX) | Units | Note |
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Die Surface | 100 | 30 | lbf | 1 |
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Die Edge | 10 | 10 | lbf | 2 |
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Notes:
1. Load specified for coplanar contact to die surface.
2. Load defined for a surface at no more than a
Chapter 10 | Mechanical Data | 47 |