Renesas HEW Target user manual 1 M30260F8AGP Memory Map with the Kernel Program

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7.3. Memory Map

The amount and locations of memory used by the kernel on the HTS Demo Kit board’s M16C/26A MCU are shown in Figure 7-1.

Figure 7-1: M30260F8AGP Memory Map with the Kernel Program

When the High-performance Embedded Workshop is used in ‘Download emulator firmware’ mode, a dialog box is displayed that allows you to place the kernel anywhere in the available user RAM and Flash ROM. Specify an area that is not used by your application software.

When the High-performance Embedded Workshop is started in ‘Does not download emulator firmware’ mode, the program area for the emulator kernel cannot be changed, because the previous setting remains effective. When you need to change the program area for the emulator kernel, restart the High- performance Embedded Workshop in ‘Download emulator firmware’ mode.

HTS Demo Kit V1.0

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December 2007

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Contents Rev December Powerful Processors - Easy to UseHEW Target Server Demo Kit User’s Manual December Table of ContentsHTS Demo Kit 1.2. Trademarks 1.0 Preface2.0 Introduction 1.1. CautionsTable 3-1 HTS Demo Kit Item List 3.0 Contents of Product Package3.1. HTS Demo Kit Item List 3.1.1. CD-ROM4.0 Limited Guarantee and Support Renesas HTS Demo Board Figure 5-1 HTS Demo Kit Connectivity 5.0 System Connectivity5.3.1. HEW High-performance Embedded Workshop 5.1. Host Computer Requirements5.2. HTS Demo Kit Board 5.3. Software Development ToolsRenesas HTS Demo Board Figure 6-1 HTS Demo Kit Board 6.0 Hardware6.1. HTS Demo Kit Board 6.3. M16C/26A Group of MCUs 6.2. HTS Demo Kit Board Block DiagramFigure 6-2 HTS Demo Kit Block Diagram 7.2. Pin and Peripheral Limitations Table 7-1 System Limitations when Debugging7.0 System Operation & Limitations 7.1. Kernel ROM Monitor IntroductionFigure 7-1 M30260F8AGP Memory Map with the Kernel Program 7.3. Memory Map7.6. Stop or Wait Mode Limitations Kit Specification2 The kernel transparently relocates the Reset vector to FFFD8h 7.4. Register Operation Limitations7.8. Performing Debug Using Symbols 8.4. Power-Up Behavior 8.0 HTS Demo Kit Board Specifications8.1. Hardware Specifications 8.3. Power Supply RequirementsAmbient Temperature 8.5. Operating EnvironmentTable 8-2 Operating and Storage Environments Environmental ConditionMCU Function Appendix A. Expansion HeadersMCUI/O HTSdemoKitRevB.pdf HTSdemoKitBOMRevB.pdf Appendix B. Board Schematic & BOMDecember HTS Demo KitDecember 3.500 inch Appendix C. HTS Demo Kit Printed Circuit BoardFigure E-1 PCB Top View Renesas HTS Demo Board