Renesas HEW Target user manual Appendix A. Expansion Headers, Mcui/O, MCU Function

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Appendix A. Expansion Headers

Appendix A. Expansion Headers

The M30260F8AGP MCU on the HTS Demo Kit target board is housed in a 48-pin QFP package. Pin 1 of the package is identified by the number ‘1’ on the board’s top silkscreen. The MCU_I/O solder pads, located below the “Renesas HTS Demo Board” sticker, provide access to some of the MCU’s pins. You can use MCU_I/O as test points to check MCU signals or, by mounting your own header, to connect your own external circuitry. The silkscreen identifying the connectors is at the top of the HTS Demo Kit board. The following table shows the mapping of MCU_I/O solder pads to MCU pins and signal names.

 

 

 

48

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MCU_I/O

 

QFP

 

 

 

 

 

 

 

 

MCU Function

 

 

Pin

 

MCU

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Vcc

11,46,

 

Vcc, VREF, AVcc

 

 

 

47

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AN4

40

 

P104/AN4/

 

 

 

 

 

 

 

 

 

KI0

 

AN5

39

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P105/AN5/ KI1

 

 

 

 

 

 

TxD2

25

P70/TxD2/ TA0OUT

 

RxD2

24

P71/RxD2/ TA0IN

 

CLK2

23

P72/CLK2/ TA1OUT/V

 

RTS2

22

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P73/ CTS2 / RTS2 / TA1IN/ V

 

 

 

 

 

 

ADTrg

36

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P15/INT3 / ADTRG / IDV

 

 

 

 

 

 

GND

9,44

 

Vss/AVss

HTS Demo Kit V1.0

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December 2007

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Contents HEW Target Server Demo Kit User’s Manual Powerful Processors - Easy to UseRev December HTS Demo Kit Table of ContentsDecember 1.0 Preface 2.0 Introduction1.1. Cautions 1.2. Trademarks3.0 Contents of Product Package 3.1. HTS Demo Kit Item List3.1.1. CD-ROM Table 3-1 HTS Demo Kit Item List4.0 Limited Guarantee and Support 5.0 System Connectivity Renesas HTS Demo Board Figure 5-1 HTS Demo Kit Connectivity5.1. Host Computer Requirements 5.2. HTS Demo Kit Board5.3. Software Development Tools 5.3.1. HEW High-performance Embedded Workshop6.1. HTS Demo Kit Board 6.0 HardwareRenesas HTS Demo Board Figure 6-1 HTS Demo Kit Board Figure 6-2 HTS Demo Kit Block Diagram 6.2. HTS Demo Kit Board Block Diagram6.3. M16C/26A Group of MCUs Table 7-1 System Limitations when Debugging 7.0 System Operation & Limitations7.1. Kernel ROM Monitor Introduction 7.2. Pin and Peripheral Limitations7.3. Memory Map Figure 7-1 M30260F8AGP Memory Map with the Kernel ProgramKit Specification 2 The kernel transparently relocates the Reset vector to FFFD8h7.4. Register Operation Limitations 7.6. Stop or Wait Mode Limitations7.8. Performing Debug Using Symbols 8.0 HTS Demo Kit Board Specifications 8.1. Hardware Specifications8.3. Power Supply Requirements 8.4. Power-Up Behavior8.5. Operating Environment Table 8-2 Operating and Storage EnvironmentsEnvironmental Condition Ambient TemperatureMCUI/O Appendix A. Expansion HeadersMCU Function Appendix B. Board Schematic & BOM HTSdemoKitRevB.pdf HTSdemoKitBOMRevB.pdfHTS Demo Kit DecemberHTS Demo Kit Appendix C. HTS Demo Kit Printed Circuit Board Figure E-1 PCB Top ViewRenesas HTS Demo Board 3.500 inch