TDK iHA48040A033V* specifications 11/17

Data Sheet: Veta® iHA48040A033V*, 3.3V/40A Output Half Brick Series

Thermal Performance (continued):

	40
	35
	30
A )	25
r r e n t (	20
p u t C u	15
O u t	10
	5
	0
	107	108	109	110	111	112	113	114
				Temperature (oC)
			1/4" HS		1/2" HS		1" HS

iHA48040A033V-001 with heatsink maximum Output Current vs. maximum allowable IMS Temperature at nominal input voltage with airflow from output to input.

	40
	35
	30
A )	25
r r e n t (	20
p u t C u	15
O u t	10
	5
	0
	105	106	107	108	109
			Temperature (oC)
		1/4" HS	1/2" HS	1" HS

iHA48040A033V-001 with heatsink maximum Output Current vs. maximum allowable IMS Temperature at nominal input voltage with airflow from input to output.

Example: : To estimate the maximum temperature at which an iHA48040A033V* Module can provide full load with 0.5 m/s (100 lfm) of airflow, at nominal line (48V) using a 1/2” heatsink with the best orientation, one must first look at the Power Dissipation vs. input voltage and Output Current plot. From this plot, it can be seen that the iHA dissipates 11.5W* of power (Pd) at full load. From the Case to Ambient Thermal Resistance vs. Airflow Rate curve, Rca is 2.4oC/W. From the Output Current vs. maximum allowable IMS Temperature plot for the best orientation heatsink application, it can be seen that the maximum allowable IMS temperature at the thermal measurement location (Tc) is 112oC. From the governing equation for the overall thermal resistance of the module, Tc - Ta = Pd x Rca, the maximum ambient temperature (Ta) is determined to be 84oC.

Complete thermal de-rating and maximum IMS temperature curves without or with a heatsink ((¼”, ½” or 1”) are available upon request from TDK Innoveta.

*Please note that the Power Dissipation curve is for Tamb = 25oC. At higher temperatures, power dissipation may be higher. Consult with TDK Innoveta if operating at high ambient temperatures.

The thermal curves provided are based upon measurements made in TDK Innoveta’s experimental test setup that is described in the Thermal Management section. Due to the large number of variables in system design, TDK Innoveta recommends that the user verify the module’s thermal performance in the end application. The critical component should be thermo-coupled and monitored, and should not exceed the temperature limit specified in the derating curve above. It is critical that the thermocouple be mounted in a manner that gives direct thermal contact otherwise significant measurement errors may result.

©2007 TDK Innoveta Inc.	' (877) 498-0099
iHA Datasheet 040207	11/17