TDK iEA Series manual Thermal Management

Data Sheet: Belleta® iEA Series –Single Output Eighth Brick

Thermal Management:

	to the airflow direction can have a significant
An important part of the overall system	impact on the module’s thermal
	performance.
design process is thermal management;
thermal design must be considered at all	Thermal Derating: For proper application of
levels to ensure good reliability and lifetime
	the power module in a given thermal
of the final system. Superior thermal design
	environment, output current derating curves
and the ability to operate in severe
	are provided as a design
application environments are key elements						Adjacent PCB
of a robust, reliable power module.
A finite amount of heat must be dissipated
		Module
from the power module to the surrounding		Centerline
environment. This heat is transferred by the
three modes of heat transfer: convection,
conduction and radiation. While all three					A	12.7
modes of heat transfer are present in every
					I	(0.50)
application, convection is the dominant					R
mode of heat transfer in most applications.					F
					L
However, to ensure adequate cooling and
					O
proper operation, all three modes should be					W
considered in a final system configuration.
	76		(3.0)
The open frame design of the power module
		AIRFLOW
provides an air path to individual
components. This air path improves
convection cooling to the surrounding
environment, which reduces areas of heat
concentration and resulting hot spots.	Air Velocity and Ambient
				Air Passage
	Temperature
				Centerline
Test Setup: The thermal performance data	Measurement Location
of the power module is based upon	Wind Tunnel Test Setup Figure Dimensions are
measurements obtained from a wind tunnel
	in millimeters and (inches).

test with the setup shown in the wind tunnel
figure. This thermal test setup replicates the	guideline on the Thermal Performance
typical thermal environments encountered in
	section for the power module of interest.
most modern electronic systems with
	The module temperature should be
distributed power architectures. The
	measured in the final system configuration
electronic equipment in networking, telecom,
	to ensure proper thermal management of
wireless, and advanced computer systems
	the power module. For thermal performance
operates in similar environments and utilizes
	verification, the module temperature should
vertically mounted PCBs or circuit cards in
	be measured at the component indicated in
cabinet racks.
	the thermal measurement location figure on
The power module, as shown in the figure,	the thermal performance page for the power
	module of interest. In all conditions, the
is mounted on a printed circuit board (PCB)
	power module should be operated below the
and is vertically oriented within the wind
	maximum operating temperature shown on
tunnel. The cross section of the airflow
	the derating curve. For improved design
passage is rectangular. The spacing
	margins and enhanced system reliability, the
between the top of the module and a parallel
	power module may be operated at
facing PCB is kept at a constant (0.5 in).
	temperatures below the maximum rated
The power module’s orientation with respect
	operating temperature.

©2004 TDK Innoveta® Inc.		￿ (877) 498-0099
iEAFullDatasheet 032707 3/29/2007	Revision 2.0	36/41