Appendix A – Environmental Info
Restriction of the Use of Hazardous Substances (RoHS)
These
Mercury, [Hg] < 1000 PPM
Hexavalent Chromium, [Cr+6] < 1000 PPM Cadmium, [Cd] < 100 PPM Polybrominated Biphenyl, [PBB] < 1000 PPM Polybrominated Diphenyl Ether, [PBDE] < 1000 PPM Moisture Sensitivity Level (MSL) =1
Maximum Soldering temperature = 260C (wave only)
Notes:
1.Lead usage in some components is exempted by the following RoHS annex; therefore, higher lead concentration could be found.
a.Lead in high melting temperature type solders (i.e.,
b.Lead in electronic ceramic parts (e.g., piezoelectronic devices).
2.Moisture Sensitivity Level (MSL) – Analysis is based on the components/material used on the board.
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