CY7C1510JV18, CY7C1525JV18
CY7C1512JV18, CY7C1514JV18
Package Diagram
Figure 4. 165-ball FBGA (15 x 17 x 1.40 mm), 51-85195
TOP VIEW
PIN 1 CORNER
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 |
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
| BOTTOM VIEW |
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| PIN 1 CORNER | |
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| Ø0.05 M C |
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| Ø0.25 M C A B |
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| Ø0.50 |
| +0.14 |
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| (165X) |
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| 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
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| A |
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| B |
| 1.00 |
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| C |
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| D | |
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| E |
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| F |
17.00±0.10 | 14.00 |
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| G |
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| H | ||
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| J |
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| K |
| 7.00 |
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| L |
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| M | |
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| N |
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| P |
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| R |
A |
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| 1.00 |
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| 5.00 |
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| 10.00 |
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| B |
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| 15.00±0.10 |
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0.15(4X)
0.25 C
0.53±0.05
C 0.36
0.35±0.06 | 0.15 C |
SEATING PLANE |
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| 1.40 MAX. |
NOTES :
SOLDER PAD TYPE : NON SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.65g
JEDEC REFERENCE :
PACKAGE CODE : BB0AD
Document #: | Page 25 of 26 |
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