Cypress CY7C199 manual Pin Rectangular Leadless Chip Carrier L54, Lead 300-Mil Molded DIP P21

Page 13

CY7C199

Package Diagrams (continued)

28-Pin Rectangular Leadless Chip Carrier L54

MIL-STD-1835C-11A

51-80067

28-Lead (300-Mil) Molded DIP P21

51-85014-B

Document #: 38-05160 Rev. **

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Contents Logic Block Diagram Pin Configurations FeaturesFunctional Description Selection GuideMaximum Ratings Electrical Characteristics Over the Operating Range3Operating Range Parameter Description Test Conditions Max Unit Capacitance4Data Retention Waveform AC Test Loads and Waveforms5Parameter Description Conditions6 Min Max Unit Read Cycle Switching Characteristics Over the Operating Range3Read Cycle No Switching WaveformsWrite Cycle No WE Controlled10, 15 Read Cycle No 13Write Cycle No CE Controlled10, 15 Write Cycle No WE Controlled OE LOW11 Typical DC and AC CharacteristicsTruth Table Inputs/Outputs Mode PowerOrdering Information Ordering Code Name Package Type Range SpeedSwitching Characteristics Group a Subgroup Testing DC CharacteristicsParameter Subgroups Lead 300-Mil CerDIP D22 Package DiagramsLead 300-Mil Molded DIP P21 Pin Rectangular Leadless Chip Carrier L54Lead 300-Mil Molded SOJ Lead 300-Mil Molded Soic S21Lead Thin Small Outline Package Z28 Date Change Description of Change REV ECN no