Cypress CY7C199 manual Lead 300-Mil Molded Soic S21, Lead 300-Mil Molded SOJ

Page 14

CY7C199

Package Diagrams (continued)

28-Lead (300-Mil) Molded SOIC S21

51-85026-A

28-Lead (300-Mil) Molded SOJ V21

51-85031-B

Document #: 38-05160 Rev. **

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Contents Functional Description FeaturesLogic Block Diagram Pin Configurations Selection GuideOperating Range Electrical Characteristics Over the Operating Range3Maximum Ratings Capacitance4 Parameter Description Test Conditions Max UnitParameter Description Conditions6 Min Max Unit AC Test Loads and Waveforms5Data Retention Waveform Switching Characteristics Over the Operating Range3 Read CycleSwitching Waveforms Read Cycle NoWrite Cycle No CE Controlled10, 15 Read Cycle No 13Write Cycle No WE Controlled10, 15 Typical DC and AC Characteristics Write Cycle No WE Controlled OE LOW11Ordering Information Inputs/Outputs Mode PowerTruth Table Speed Ordering Code Name Package Type RangeParameter Subgroups Group a Subgroup Testing DC CharacteristicsSwitching Characteristics Package Diagrams Lead 300-Mil CerDIP D22Pin Rectangular Leadless Chip Carrier L54 Lead 300-Mil Molded DIP P21Lead 300-Mil Molded Soic S21 Lead 300-Mil Molded SOJLead Thin Small Outline Package Z28 REV ECN no Date Change Description of Change
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