Cypress CY7C199 manual Lead Thin Small Outline Package Z28

Page 15

CY7C199

Package Diagrams (continued)

28-Lead Thin Small Outline Package Z28

51-85071-F

Document #: 38-05160 Rev. **

Page 15 of 16

© Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semico nductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress

Image 15

Contents Selection Guide FeaturesLogic Block Diagram Pin Configurations Functional DescriptionElectrical Characteristics Over the Operating Range3 Maximum RatingsOperating Range Parameter Description Test Conditions Max Unit Capacitance4AC Test Loads and Waveforms5 Data Retention WaveformParameter Description Conditions6 Min Max Unit Read Cycle Switching Characteristics Over the Operating Range3Read Cycle No Switching WaveformsRead Cycle No 13 Write Cycle No WE Controlled10, 15Write Cycle No CE Controlled10, 15 Write Cycle No WE Controlled OE LOW11 Typical DC and AC CharacteristicsInputs/Outputs Mode Power Truth TableOrdering Information Ordering Code Name Package Type Range SpeedGroup a Subgroup Testing DC Characteristics Switching CharacteristicsParameter Subgroups Lead 300-Mil CerDIP D22 Package DiagramsLead 300-Mil Molded DIP P21 Pin Rectangular Leadless Chip Carrier L54Lead 300-Mil Molded SOJ Lead 300-Mil Molded Soic S21Lead Thin Small Outline Package Z28 Date Change Description of Change REV ECN no