Toshiba B-442-QP, EM1-33046AE owner manual CARE/HANDLING of the Media and Ribbon, Core Shape

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2. SPECIFICATIONS

EM1-33046A

2.5 CARE/HANDLING OF THE MEDIA AND RIBBON

<Core Shape>

25.7 ± 0.3 mm

Max. 105 ± 0.5 mm

Fig. 2-8

NOTE: When purchasing ribbon locally, they must meet the above size. There may be TEC-approved ribbons which do not fall within the above size, however, they have no functional problem.

Treated back side

Base

Core

Core

Ink outside

 

Adhesive tape

Adhesive tape

Leader tape

Ink ribbon

 

Adhesive tape

End tape

(Non Transmissive)

Fig. 2-9 Connection between leader tape and ribbon

2.5 CARE/HANDLING OF THE MEDIA AND RIBBON

CAUTION:

Be sure to read carefully and understand the Supply Manual. Use only media and ribbon which meet specified requirements. Use of non-specified media and ribbon may shorten the head life and result in problems with bar code readability or print quality. All media and ribbon should be handled with care to avoid any damage to the media, ribbon or printer. Read the following guideline carefully.

Do not store the media and ribbon for longer than the manufactures recommended shelf life.

Store media rolls on the flat end, do not store them on the curved sides as this might flatten that side causing erratic media advance and poor print quality.

Store the media in plastic bags and always reseal after opening. Unprotected media can get dirty and the extra abrasion from the dust and dirt particles will shorten the print head life.

Store the media and ribbon in a cool, dry place. Avoid areas where they would be exposed to direct sunlight, high temperature, high humidity, dust or gas.

The thermal paper used for direct thermal printing must not have the specifications which exceed Na+ 800 ppm, K+ 250 ppm and CL- 500 ppm.

Some ink used on pre-printed labels may contain ingredients which shorten the print head’s product life. Do not use labels pre-printed with ink which contain hard substances such as carbonic calcium (CaCO3) and kaolin (Al2O3, 2SiO2, 2H2O).

For further information please contact your local distributor or your media and ribbon manufacturer.

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Contents 442 EMC List of Standards of Conformity EU onlySafety Summary Request Regarding Maintenance PrecautionsTable of Contents Introduction FeaturesSafety Summary Applicable Model Equipment ChecklistUnpacking and Inspection 4 2 Q QPrinter SpecificationsCommunications Interface Options525.0 mm~115.0 mm MediaRibbon Core Shape CARE/HANDLING of the Media and RibbonPrinter Parts OverviewInterior View External Label Roll Mount External Label Roll MountSwitches and Indicator Lights DIP Switch Functions Setting UP the Printer SET UP ProcedureRequirements for Operation RS-232C Serial InterfaceLoading Label and TAG Stock Inserting Label Supply Roll into Label Supply Roll Mounts SELF-PEELING Function Setting Up Printer for Self-Peeling FunctionRibbon Loading Instructions Placement of Ribbon Supply RollProper Placement of Label Stock and Thermal Transfer Ribbon Install External Label Roll Mount Install External Label Roll MountInstall Memory Module Option Install Memory ModuleSelf Test Dump Mode Cleaning General MaintenanceCovers and Panels Density AdjustmentRemoving Jammed Media Problem Solution Trouble ShootingError Messages Example HOW to Connect the Printer with Portable LCD Keyboard

B-442-QP, B-442, EM1-33046AE, EM1-33046A specifications

The Toshiba EM1-33046A and EM1-33046AE are advanced semiconductor devices primarily designed for high-performance applications. These models are part of Toshiba's broader portfolio, which emphasizes cutting-edge technology and reliability. The EM1-33046A offers impressive operational capabilities and is well-regarded for its low power consumption, making it ideal for energy-sensitive applications.

One of the distinguishing features of the EM1-33046A and its variant, the EM1-33046AE, is their robust operational range. They are engineered to handle varying voltage levels efficiently while maintaining performance stability. This adaptability is crucial in fields such as automotive electronics, industrial automation, and consumer electronics, where devices must operate under diverse conditions. Furthermore, these components are built with integrated protective mechanisms, enhancing their reliability and longevity.

Complementing these models are the B-442 and B-442-QP series. The B-442 is known for its exceptional power management capabilities. It features an advanced architecture that optimizes the distribution of power across multiple channels, ensuring that electronic systems run smoothly and efficiently. The B-442-QP variant, on the other hand, introduces enhanced performance metrics, offering quicker response times and improved thermal management. This makes it perfect for applications that require rapid processing and minimal heat generation.

Both the B-442 and B-442-QP benefit from Toshiba's innovative power semiconductor technology. They utilize cutting-edge fabrication techniques, resulting in high-efficiency performance while minimizing energy waste. The devices are also designed with advanced thermal characteristics, allowing them to operate at higher temperatures without compromising functionality.

In summary, the Toshiba EM1-33046A, EM1-33046AE, B-442, and B-442-QP series are engineered for high performance and efficiency. Their unique combination of features makes them suitable for various applications, including automotive, industrial, and consumer electronics. These models not only showcase Toshiba's commitment to innovation but also their dedication to providing reliable, energy-efficient solutions for modern electronic systems. The integration of these technologies positions Toshiba as a leader in the semiconductor industry, meeting the evolving demands of a wide range of applications.