Toshiba EM1-33046AE, B-442-QP Covers and Panels, Removing Jammed Media, Density Adjustment

Page 30

13. GENERAL MAINTENANCE

EM1-33046A

13.2 COVERS AND PANELS

13.2 COVERS AND PANELS

The covers should be cleaned by wiping with a dry cloth or a cloth slightly dampened with a mild detergent solution.

NOTE: Clean printer cover with an electrostatic free cleaner for automated office equipment.

WARNING!

1.DO NOT POUR WATER directly onto the printer.

2.DO NOT APPLY cleaner or detergent directly onto any cover or panel.

3.NEVER USE THINNER OR OTHER VOLATILE SOLVENT on the plastic covers.

4.DO NOT clean the panel covers or the supply window with alcohol as it may cause them to discolor, loose their shape or develop structural weakness.

13.3 REMOVING JAMMED MEDIA

1.Turn the power off.

2.Open the printer cover.

3.Open the printer carriage by pulling up the release lever on the forward left side of the front rubber roller.

4.Remove the ribbon and media.

5.Remove the jammed media. DO NOT USE any sharp implement or tool as these could damage the printer.

6.Clean the print head and front rubber roller, then remove any further dust or foreign substances.

7.Media jams in the cutter unit can be caused by wear or residual glue from label stock on the cutter. Do not use unspecified media in the cutter. If you get frequent jams in the cutter contact your Authorized Service representative.

13.4 DENSITY ADJUSTMENT

Density adjustment may be necessary according to the temperature of environment in use.

(Reference: Interface Command Manual)

13-2

Image 30
Contents 442 List of Standards of Conformity EU only EMCSafety Summary Precautions Request Regarding MaintenanceTable of Contents Features IntroductionSafety Summary Unpacking and Inspection Equipment ChecklistApplicable Model 4 2 Q QSpecifications PrinterOptions Communications InterfaceMedia 525.0 mm~115.0 mmRibbon CARE/HANDLING of the Media and Ribbon Core ShapeOverview Printer PartsInterior View External Label Roll Mount External Label Roll MountSwitches and Indicator Lights DIP Switch Functions Requirements for Operation SET UP ProcedureSetting UP the Printer RS-232C Serial InterfaceLoading Label and TAG Stock Inserting Label Supply Roll into Label Supply Roll Mounts Setting Up Printer for Self-Peeling Function SELF-PEELING FunctionPlacement of Ribbon Supply Roll Ribbon Loading InstructionsProper Placement of Label Stock and Thermal Transfer Ribbon Install External Label Roll Mount Install External Label Roll MountInstall Memory Module Install Memory Module OptionSelf Test Dump Mode General Maintenance CleaningDensity Adjustment Covers and PanelsRemoving Jammed Media Trouble Shooting Problem SolutionError Messages HOW to Connect the Printer with Portable LCD Keyboard Example

B-442-QP, B-442, EM1-33046AE, EM1-33046A specifications

The Toshiba EM1-33046A and EM1-33046AE are advanced semiconductor devices primarily designed for high-performance applications. These models are part of Toshiba's broader portfolio, which emphasizes cutting-edge technology and reliability. The EM1-33046A offers impressive operational capabilities and is well-regarded for its low power consumption, making it ideal for energy-sensitive applications.

One of the distinguishing features of the EM1-33046A and its variant, the EM1-33046AE, is their robust operational range. They are engineered to handle varying voltage levels efficiently while maintaining performance stability. This adaptability is crucial in fields such as automotive electronics, industrial automation, and consumer electronics, where devices must operate under diverse conditions. Furthermore, these components are built with integrated protective mechanisms, enhancing their reliability and longevity.

Complementing these models are the B-442 and B-442-QP series. The B-442 is known for its exceptional power management capabilities. It features an advanced architecture that optimizes the distribution of power across multiple channels, ensuring that electronic systems run smoothly and efficiently. The B-442-QP variant, on the other hand, introduces enhanced performance metrics, offering quicker response times and improved thermal management. This makes it perfect for applications that require rapid processing and minimal heat generation.

Both the B-442 and B-442-QP benefit from Toshiba's innovative power semiconductor technology. They utilize cutting-edge fabrication techniques, resulting in high-efficiency performance while minimizing energy waste. The devices are also designed with advanced thermal characteristics, allowing them to operate at higher temperatures without compromising functionality.

In summary, the Toshiba EM1-33046A, EM1-33046AE, B-442, and B-442-QP series are engineered for high performance and efficiency. Their unique combination of features makes them suitable for various applications, including automotive, industrial, and consumer electronics. These models not only showcase Toshiba's commitment to innovation but also their dedication to providing reliable, energy-efficient solutions for modern electronic systems. The integration of these technologies positions Toshiba as a leader in the semiconductor industry, meeting the evolving demands of a wide range of applications.