Apple Desktop Computer manual Sdram Devices

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C H A P T E R 4

RAM Expansion

The JEDEC specification for the SO-DIMM defines a Serial Presence Detect (SPD) feature that contains the attributes of the module. SO-DIMMs for use in the iMac are required to have the SPD feature. Information about the required values to be stored in the presence detect EEPROM is in section 4.1.2.5 and Figure 4.5.6–C (144 Pin SDRAM SO–DIMM, PD INFORMATION) of the JEDEC standard 21-C specification, release 7.

Because the SO-DIMM connector has only two clock lines, and each clock line is limited to only 4 loads, an SO-DIMM with more than 8 SDRAM devices must have buffers on the clock lines. The buffers must be zero-delay type, such as phase-lock loop (PLL), which regenerates the clock signals. For example, the computer can support a 128-MB SO-DIMM using 16 devices and a PLL clock buffer.

SDRAM Devices

The SDRAM devices used in the RAM expansion modules must be self-refresh type devices for operation from a 3.3-V power supply. The speed of the SDRAM devices must be 100 MHz or greater, corresponding to a cycle time of 10 ns or less.

The devices are programmed to operate with a CAS latency of 3. At that CAS latency, the access time from the clock transition must be 7 ns or less. The burst length must be at least 4 and the minimum clock delay for back-to-back random column access cycles must be a latency of 1 clock cycle.

50Main RAM Expansion

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Contents Apple iMac Computer Page Contents Devices and Ports RAM ExpansionSoftware RtasAppendix Abbreviations Index Rtas NV-RAMFigures and Tables Page Contents of This Note About This Developer NoteMac OS PowerPC G3 MicroprocessorSupplemental Reference Documents ATA DevicesUSB Devices Open FirmwareE F a C E Introduction Features Case and External Features Shows a front view of the computerFront view 2Side view showing I/O bay Compatibility Issues System SoftwareUSB Ports and Devices Main RAM Expansion ModulesVideo RAM Expansion Modules Page Architecture Architecture Backside Cache Processor moduleG3 Microprocessor Controller IC Main Logic BoardMemory Controller and PCI Bridge Built-in Modem USB ControllerVideo Display Subsystem Infrared Link Module Devices and Ports USB Connectors USB PortsTransfer Types Supported GNDUSB Compatibility Issues ADB CompatibilityUSB Storage Devices Serial Port CompatibilityMacintosh-To-Macintosh Connections USB ControllerKeyboard Keyboard LayoutMouse Keyboard and USBHard Disk Drive Video DisplayInfrared Communication Link Sound SystemBuilt-in Microphone Sound InputsSound Outputs External Sound InputHeadphone Jacks Sound SpecificationsExternal Sound Output Total harmonic distortion Ethernet Port Internal ModemPage RAM Expansion Placing the Computer Face Down Removing the Logic Board AssemblyExpansion Slots Removing the bottom cover Unfastening the CablesRAM Expansion 3Logic board assembly handle and retaining screws Removing the Retaining ScrewsRemoving the Logic Board Assembly Removing the EMI ShieldLocations of the Expansion Slots Main RAM Expansion 6Locations of the RAM expansion slotsMechanical Design of RAM SO-DIMMs Electrical Design of RAM SO-DIMMsSdram Devices Configuration of RAM SO-DIMMs RAM SO-DIMM Electrical Limits Address MultiplexingVideo RAM Expansion Page Software Why Make This Change? What Has Changed Features of the New Approach User Experience PerformanceRAM Footprint Data Structures and FilesBoot ROM Contents Mac OS ndrv Drivers RtasToolbox Image File Contents ToolBox ROM Image NewWorld Boot ProcessTrampoline Code What Is Different Interrupt HandlingOutmoded Resources RAM FootprintNanoKernel Startup Disk Control PanelMachine Identification Open Firmware and the Device TreeInterrupt Layout Software Abbreviations Chrp NMI Page Index Nvram X, Y, Z Allen Watson