Samsung 164BX user manual Shows the Fan/Heat-Sink Assembly on AlphaPC 164UX

Increasing Microprocessor Speed

6.Install the heat sink and heat-sink fan as directed in the following steps. A heat- sink/fan kit is available from the vendor listed at the beginning of this procedure. Refer to Figure 5–2for heat-sink and fan assembly details.

Figure 5-1 shows the Fan/Heat-Sink Assembly on AlphaPC 164UX.

Figure 5–2 Fan/Heat-Sink Assembly

Screw, 6-32 x 0.875 in

Qty 4

Guard, Fan

Fan

Clip, Heat Sink/Chip/Fan

Nut, Hex, 1/4-20, 2011-T3

Aluminum, 0.438 in Across

Flats, Qty 2

Torque to 20 +/- 2 in-lbs

Heat Sink, with Fan

Mounting Holes

Thermal Pad

Airflow

Alpha 21164

a.Put the GRAFOIL thermal pad in place. The GRAFOIL pad is used to improve the thermal conductivity between the chip package and the heat sink by replacing micro air pockets with a less insulative material. Perform the following steps to position the GRAFOIL pad:

1.Perform a visual inspection of the package slug to ensure that it is free of contamination.

2.Wearing clean gloves, pick up the GRAFOIL pad. Do not perform this with bare hands because skin oils can be transferred to the pad.

5–6Memory and Microprocessor Configuration