Samsung 1H 2011 Mlc Qdp Slc Ddp Mlc Ddp Mlc Dsp Slc Dsp, SLC Single S/B, Cob, Chip BIZ D 63-TBGA

FLASH Product Ordering Information

1	2	3	4	5	6	7	8	9	10	11	12	13	14	15
K	9	X	X	X	X	X	X	X	X	-	X	X	X	X
SAMSUNG Memory														Pre-Program Version
NAND Flash														Customer Bad Block
Small Classification														Temp
Density														Package
Density														---
Organization														Generation
Organization														Mode
Vcc

A SH

1.Memory (K)

2.NAND Flash : 9

3.Small Classification

(SLC : Single Level Cell, MLC : Multi Level Cell)

7 : SLC moviNAND

8 : MLC moviNAND

F : SLC Normal

G : MLC Normal

H : MLC QDP

K : SLC DDP

L : MLC DDP

M : MLC DSP

N : SLC DSP

P : MLC 8 Die Stack

Q : SLC 8 Die Stack

S : SLC Single SM

T : SLC SINGLE (S/B)

U : 2 Stack MSP

W : SLC 4 Die Stack

4~5. Density

12 : 512M

56 : 256M

1G : 1G

2G : 2G

4G : 4G

8G : 8G

AG : 16G BG :

32G CG : 64G

DG : 128G

EG : 256G

LG : 24G

NG : 96G

ZG : 48G

00 : NONE

6~7. Organization

00 : NONE

08 : x8

16 : x16

8. Vcc

A : 1.65V~3.6V	B : 2.7V (2.5V~2.9V)
C : 5.0V (4.5V~5.5V)	D : 2.65V (2.4V~2.9V)
E : 2.3V~3.6V	R : 1.8V (1.65V~1.95V)
Q : 1.8V (1.7V~1.95V)	T : 2.4V~3.0V
U : 2.7V~3.6V	V : 3.3V (3.0V~3.6V)
W : 2.7V~5.5V, 3.0V~5.5V	0 : NONE
9. Mode

0 : Normal

1 : Dual nCE & Dual R/nB

3 : Tri /CE & Tri R/B

4 : Quad nCE & Single R/nB

5 : Quad nCE & Quad R/nB

9 : 1st block OTP

A : Mask Option 1

L : Low grade

10. Generation

M : 1st Generation

A : 2nd Generation

B : 3rd Generation

C : 4th Generation

D : 5th Generation

11.“ ----”

12.Package

A : COB

B : FBGA (Halogen-Free, Lead-Free)

C : CHIP BIZ D : 63-TBGA

F : WSOP (Lead-Free) G : FBGA

H : TBGA (Lead-Free)

I : ULGA (Lead-Free) (12*17)

J : FBGA (Lead-Free)

L : ULGA (Lead-Free) (14*18)

M : TLGA N : TLGA2

P : TSOP1 (Lead-Free)

Q : TSOP2 (Lead-Free)

S : TSOP1 (Halogen-Free, Lead-Free)

T : TSOP2 U : COB (MMC)

V : WSOP W : Wafer

Y : TSOP1 Z : WELP (Lead-Free)

13. Temp

C : Commercial I : Industrial

0 : NONE (Containing Wafer, CHIP, BIZ, Exception

handling code)

14. Customer Bad Block

B : Include Bad Block

D : Daisychain Sample

L : 1~5 Bad Block

N : ini. 0 blk, add. 10 blk

S : All Good Block

0 : NONE (Containing Wafer, CHIP, BIZ, Exception handling code)

15. Pre-Program Version

0 : None

Serial (1~9, A~Z)

FL

samsung.com/semi/flash

1H 2011

Flash Ordering Information 15