Samsung 1H 2011 manual DDR2 Sdram Unbuffered Modules ECC, DDR2 Sdram Sodimm Modules

DDR2 SDRAM UNBUFFERED MODULES

Density	Organization	Part Number	Composition	Compliance	Speed (Mbps)	Rank	Production
1GB	128Mx64	M378T2863FBS-C(E6/F7/E7)	(128M x8)*8	Lead free	667/800	1	Now
2GB	256Mx64	M378T5663FB3-C(E6/F7/E7)	(128M x8)*16	Lead free	667/800	2	Now
Notes:	E6 = PC2-5300 (DDR2-667 @ CL=5)		E7 = PC2-6400 (DDR2-800 @ CL=5)		F7 = PC2-6400 (DDR2-800 @ CL=6)		Voltage = 1.8V

DDR2 SDRAM UNBUFFERED MODULES (ECC)

Density	Organization	Part Number	Composition	Compliance	Speed (Mbps)	Rank	Production
1GB	128Mx72	M391T2863FB3-C(E6/F7)	(128Mx8)*9	Lead free	667/800	1	Now
2GB	256Mx64	M391T5663FB3-C(E6/F7)	(128Mx8)*18	Lead free	667/800	2	Now
Notes:	E6 = PC2-5300 (DDR2-667 @ CL=5)		F7 = PC2-6400 (DDR2-800 @ CL=6)
	E7 = PC2-6400 (DDR2-800 @ CL=5)		Voltage = 1.8V

DDR2 SDRAM SODIMM MODULES

Density	Organization	Part Number	Composition	Compliance	Speed (Mbps)	Rank	Production
1GB	128Mx64	M470T2863FB3-C(E6/F7/E7)	(64Mx16)*8	Lead free	667/800	2	Now
2GB	256Mx64	M470T5663FB3-C(E6/F7/E7)	(128M x8)*8	Lead free	667/800	2	Now
Notes:	E6 = PC2-5300 (DDR2-667 @ CL=5)		F7 = PC2-6400 (DDR2-800 @ CL=6)
	E7 = PC2-6400 (DDR2-800 @ CL=5)		Voltage = 1.8V

DDR2 SDRAM COMPONENTS

Density	Organization	Part Number	# Pins-Package	Dimensions	Package	Speed (Mbps)	Production
256Mb	16Mx16	K4T56163QN-HC(E6/F7/E7/F8)	84-FBGA	7.5x12.5mm	Lead free & Halogen free	667/800/1066	Now
	128M x4	K4T51043QI-HC(E6/F7/E7)	60-FBGA	7.5x9.5mm	Lead free & Halogen free	667/800	Now
	64M x8	K4T51083QI-HC(E6/F7/E7/F8)	60-FBGA	7.5x9.5mm	Lead free & Halogen free	667/800/1066	Now
512Mb	32M x16	K4T51163QI-HC(E6/F7/E7/F8)	84-FBGA	7.5x12.5mm	Lead free & Halogen free	667/800/1066	Now
	128M x4	K4T51043QJ-HC(E6/F7/E7)	60-FBGA	7.5x9.5mm	Lead free & Halogen free	667/800	Q3
	64M x8	K4T51083QJ-HC(E6/F7/E7/F8)	60-FBGA	7.5x9.5mm	Lead free & Halogen free	667/800/1066	Q3
	32M x16	K4T51163QJ-HC(E6/F7/E7/F8)	84-FBGA	7.5x12.5mm	Lead free & Halogen free	667/800/1066	Q3
	256M x4	K4T1G044QF-BC(E6/F7/E7)	60-FBGA	7.5x9.5mm	Lead free & Halogen free	667/800	Now
1Gb	128M x8	K4T1G084QF-BC(E6/F7/E7/F8)	60-FBGA	7.5x9.5mm	Lead free & Halogen free	667/800/1066	Now
	64M x16	K4T1G164QF-BC(E6/F7/E7/F8)	84-FBGA	7.5x12.5mm	Lead free & Halogen free	667/800/1066	Now
Notes:	E6 = DDR2-667 (5-5-5)	F8 = DDR2-1066 (7-7-7)	Package Type
	F7 = DDR2-800 (6-6-6)	Voltage = 1.8V	H = FBGA (Lead-free & Halogen-free)
	E7 = DDR2-800 (5-5-5)		B = FBGA (Lead-free & Halogen-free, Flip Chip)

DDR SDRAM COMPONENTS

Density	Organization	Part Number	# Pins - Package	Speed (Mbps)
	128Mx4	K4H510438J-LCB3/B0	66-TSOP	266/333
		K4H510438J-HCCC/B3	60-FBGA	333/400
512Mb	64Mx8	K4H510838J-LCCC/B3	66-TSOP	333/400
		K4H510838J-HCCC/B3	60-FBGA	333/400
	32Mx16	K4H511638J-LCCC/B3	66-TSOP	333/400
	64Mx4	K4H560438N-LCB3/B0	66-TSOP	266/333
256Mb	32Mx8	K4H560838N-LCCC/B3	66-TSOP	333/400
	16Mx16	K4H561638N-LCCC/B3	66-TSOP	333/400
128Mb	8Mx16	K4H281638O-LCCC	66-TSOP	400
Notes:	B0 = DDR266 (133MHz @ CL=2.5)	A2 = DDR266 (133MHz @ Cl=2)	B3 = DDR333 (166MHz @ CL=2.5)	CC = DDR400 (200MHz @ CL=3)

SDRAM COMPONENTS

Density	Organization	Part Number	# Pins - Package	Speed (Mbps)	Refresh
	64Mx4	K4S560432N-LC(L)75000	54-TSOP	133	8K
256Mb	32Mx8	K4S560832N-LC(L)75000	54-TSOP	133	8K
	16Mx16	K4S561632N-LC(L)(75/60)000	54-TSOP	133/166	8K
128Mb	16Mx8	K4S280832O-LC(L)75000	54-TSOP	133	4K
	8Mx16	K4S281632O-LC(L)(75/60)000	54-TSOP	133/166	4K
Notes:	L = Commercial Temp., Low Power		Banks: 4	Voltage: 3.3V
	For Industrial Temperature, check with SSI Marketing		All products are Lead Free	Speed: PC133 (133MHz CL=3/PC100 CL2)

8DDR2, DDR & SDRAM Components

1H 2011

samsung.com/semi/dram