Philips L06.1E AA technical specifications L06.1E Safety Instructions, Warnings, and Notes

EN 6 2. L06.1E Safety Instructions, Warnings, and Notes

semiconductors in the unit, irrespective of the type indication on these semiconductors.

•Manufactured under license from Dolby Laboratories. “Dolby”, “Pro Logic” and the “double-D symbol”, are trademarks of Dolby Laboratories.

2.4.2Schematic Notes

•All resistor values are in ohms, and the value multiplier is often used to indicate the decimal point location (e.g. 2K2 indicates 2.2 kohm).

•Resistor values with no multiplier may be indicated with either an "E" or an "R" (e.g. 220E or 220R indicates 220 ohm).

•All capacitor values are given in micro-farads (∝= x10-6), nano-farads (n= x10-9), or pico-farads (p= x10-12).

•Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF).

•An "asterisk" (*) indicates component usage varies. Refer to the diversity tables for the correct values.

•The correct component values are listed in the Spare Parts List. Therefore, always check this list when there is any doubt.

2.4.3Rework on BGA (Ball Grid Array) ICs

General

Although (LF)BGA assembly yields are very high, there may still be a requirement for component rework. By rework, we mean the process of removing the component from the PWB and replacing it with a new component. If an (LF)BGA is removed from a PWB, the solder balls of the component are deformed drastically so the removed (LF)BGA has to be discarded.

Device Removal

As is the case with any component that is being removed, it is essential when removing an (LF)BGA, that the board, tracks, solder lands, or surrounding components are not damaged. To remove an (LF)BGA, the board must be uniformly heated to a temperature close to the reflow soldering temperature. A uniform temperature reduces the risk of warping the PWB. To do this, we recommend that the board is heated until it is certain that all the joints are molten. Then carefully pull the component off the board with a vacuum nozzle. For the appropriate temperature profiles, see the IC data sheet.

Area Preparation

When the component has been removed, the vacant IC area must be cleaned before replacing the (LF)BGA.

Removing an IC often leaves varying amounts of solder on the mounting lands. This excessive solder can be removed with either a solder sucker or solder wick. The remaining flux can be removed with a brush and cleaning agent.

After the board is properly cleaned and inspected, apply flux on the solder lands and on the connection balls of the (LF)BGA. Note: Do not apply solder paste, as this has been shown to result in problems during re-soldering.

Device Replacement

The last step in the repair process is to solder the new component on the board. Ideally, the (LF)BGA should be aligned under a microscope or magnifying glass. If this is not possible, try to align the (LF)BGA with any board markers. So as not to damage neighbouring components, it may be necessary to reduce some temperatures and times.

More Information

For more information on how to handle BGA devices, visit this URL: www.atyourservice.ce.philips.com (needs subscription, not available for all regions). After login, select “Magazine”, then go to “Repair downloads”. Here you will find Information on how to deal with BGA-ICs.

2.4.4Lead-free Solder

Philips CE is producing lead-free sets (PBF) from 1.1.2005 onwards.

Identification: The bottom line of a type plate gives a 14-digit serial number. Digits 5 and 6 refer to the production year, digits 7 and 8 refer to production week (in example below it is 1991 week 18).

E_06532_024.eps 230205

Figure 2-2 Serial number example

Regardless of the special lead-free logo (which is not always indicated), one must treat all sets from this date onwards according to the rules as described below.

Pb

Figure 2-3 Lead-free logo

Due to lead-free technology some rules have to be respected by the workshop during a repair:

•Use only lead-free soldering tin Philips SAC305 with order code 0622 149 00106. If lead-free solder paste is required, please contact the manufacturer of your soldering equipment. In general, use of solder paste within workshops should be avoided because paste is not easy to store and to handle.

•Use only adequate solder tools applicable for lead-free soldering tin. The solder tool must be able:

–To reach a solder-tip temperature of at least 400°C.

–To stabilise the adjusted temperature at the solder-tip.

–To exchange solder-tips for different applications.

•Adjust your solder tool so that a temperature of around 360°C - 380°C is reached and stabilised at the solder joint. Heating time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C, otherwise wear-out of tips will increase drastically and flux-fluid will be destroyed. To avoid wear-out of tips, switch “off” unused equipment or reduce heat.

•Mix of lead-free soldering tin/parts with leaded soldering tin/parts is possible but PHILIPS recommends strongly to avoid mixed regimes. If this cannot be avoided, carefully clean the solder-joint from old tin and re-solder with new tin.

•Use only original spare-parts listed in the Service-Manuals. Not listed standard material (commodities) has to be purchased at external companies.

•Special information for lead-free BGA ICs: these ICs will be delivered in so-called "dry-packaging" to protect the IC against moisture. This packaging may only be opened shortly before it is used (soldered). Otherwise the body of the IC gets "wet" inside and during the heating time the structure of the IC will be destroyed due to high (steam-) pressure inside the body. If the packaging was opened before usage, the IC has to be heated up for some hours (around 90°C) for drying (think of ESD-protection!).

Do not re-use BGAs at all!