Sony Ericsson NWZ-A826 For Printed Wiring Boards, For Schematic Diagrams, Side a, Side B

NWZ-A826/A826K/A828/A828K/A829

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.)

For Printed Wiring Boards.

Note:

•X : Parts extracted from the component side.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:
Parts face side:	Parts on the parts face side seen from
(SIDE A)	the pattern face are indicated.
Pattern face side:	Parts on the pattern face side seen from
(SIDE B)	the parts face are indicated.

•MAIN and SW boards are mulyi-layer printed board. However, the patterns of intermediate-layers have not been included in diagrams.

•Indication of transistor.

C
Q	These are omitted.

BE

•Lead layouts

surface

For Schematic Diagrams.

Note:

•All capacitors are in μF unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•C: panel designation.

•A : B+ Line.

•Power voltages is dc 3.7 V and fed with regutated dc pow- er supply fron CN901 pin 1 and 2 on the MAIN board.

•Voltages and waveforms are dc with respect to ground under no-signal conditions.

no mark: PLAY BACK

•Waveforms is taken with a oscilloscope.

Voltage variations may be noted due to normal production tolerances.

•Voltages are taken with VOM (Input impedance 10 MΩ).

•Voltage variations may be noted due to normal production tolerances.

•Circled numbers refer to waveforms.

•Signal path.

F : AUDIO

L : VIDEO

•The voltage and waveform of CSP (chip size package) cannot be measured, decause its lead layout is different form that of conventional IC.

Lead layout of conventional IC CSP (Chip Size Package)

NWZ-A826/A826K/A828/A828K/A829

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