HP x360 - 13-a113cl, x360 - 13-a155cl Grounding guidelines, Electrostatic discharge damage, Event

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Grounding guidelines

Electrostatic discharge damage

Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure determine the degree of sensitivity. Networks built into many integrated circuits provide some protection, but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.

A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.

An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life expectancy.

CAUTION: To prevent damage to the tablet when you are removing or installing internal components, observe these precautions:

Keep components in their electrostatic-safe containers until you are ready to install them.

Before touching an electronic component, discharge static electricity by using the guidelines described in this section.

Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible. If you remove a component, place it in an electrostatic-safe container.

The following table shows how humidity affects the electrostatic voltage levels generated by different activities.

CAUTION: A product can be degraded by as little as 700 V.

Typical electrostatic voltage levels

 

 

Relative humidity

 

 

 

 

 

Event

10%

40%

55%

 

 

 

 

Walking across carpet

35,000 V

15,000 V

7,500 V

 

 

 

 

Walking across vinyl floor

12,000 V

5,000 V

3,000 V

 

 

 

 

Motions of bench worker

6,000 V

800 V

400 V

 

 

 

 

Removing DIPS from plastic tube

2,000 V

700 V

400 V

 

 

 

 

Removing DIPS from vinyl tray

11,500 V

4,000 V

2,000 V

 

 

 

 

Removing DIPS from Styrofoam

14,500 V

5,000 V

3,500 V

 

 

 

 

Removing bubble pack from PCB

26,500 V

20,000 V

7,000 V

 

 

 

 

Packing PCBs in foam-lined box

21,000 V

11,000 V

5,000 V

 

 

 

 

26 Chapter 4 Removal and replacement preliminary requirements

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Contents HP Pavilion x360 Convertible PC Product notice Safety warning notice Iv Safety warning notice Table of contents Downloading HP PC Hardware Diagnostics Uefi to a USB device Product description Product description Wireless EthernetExternal media cards PortsPower requirements Serviceability End user replaceable partsSecurity Operating systemExternal component identification DisplayDisplay Component DescriptionButtons and speakers External component identificationKeys KeysLights TouchPad TouchPadLeft side Right side Right sideBottom Illustrated parts catalog Locating the serial number, product number, and model numberComputer major components Illustrated parts catalogComputer major components ComponentComponent Spare part number Wlan moduleBottom cover Power connector cablePower button board includes cable Display back cover Display assembly componentsDisplay panel cable Miscellaneous parts Miscellaneous partsSequential part number listing Spare part number DescriptionSequential part number listing Illustrated parts catalog Sequential part number listing Illustrated parts catalog Removal and replacement preliminary requirements Service considerationsPlastic parts Cables and connectors Tools requiredRemoval and replacement preliminary requirements Grounding guidelinesElectrostatic discharge damage Typical electrostatic voltage levelsPackaging and transporting guidelines Equipment guidelines Material Use Voltage protection levelRemoval and replacement procedures Computer feetKeyboard/top cover Page Page TouchPad Battery Hard drive Wlan module Page Reverse this procedure to install the Wlan module Audio/USB boardFan Description Spare part number Fan includes cable 768021-001Speakers Power button board Display assembly Page Page Page Page Page Power connector cable System board Page Heat sink Remove the heat sink Heat sinkPage Reverse this procedure to install the heat sink Memory modulePage Determining the Bios version Starting Setup Utility BiosUpdating the Bios Downloading a Bios update Using HP PC Hardware Diagnostics Uefi Downloading HP PC Hardware Diagnostics Uefi to a USB deviceSpecifications SpecificationsBacking up, restoring, and recovering Creating recovery media and backupsCreating HP Recovery media Backing up, restoring, and recoveringRestore and recovery Restore and recoveryRecovering using HP Recovery Manager What you need to knowUsing the HP Recovery partition select models only Removing the HP Recovery partition select models only Power cord set requirements Requirements for all countriesRequirements for specific countries and regions Requirements for all countriesPower cord set requirements BSIRecycling Index Hdmi
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