4.Remove the fan/heat sink assembly (4).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach it from the system board.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed: Thermal paste is used on the processor (1) and the fan/heat sink assembly section (2) that services it.
Reverse this procedure to install the fan/heat sink assembly.
70 | Chapter 4 Removal and replacement procedures |