HP 8200 tower manual Feature Differences by Form Factor, Usdt SFF CMT

System Overview

Table 2-1 shows the differences in features between the different PC series based on form factor.

Table 2-1

Feature Differences by Form Factor

	USDT	SFF	MT	CMT
Thermal Design Power (TPD)	65 W	95 W	95 W	95 W
(processor)
# and type of memory sockets	2 DDR3	4 DDR3	4 DDR3	4 DDR3
	SODIMMs	UDIMMs	UDIMMs	UDIMMs
Serial ports	0	1 std.,	1 std.,	1 std.,
		1 opt. [1]	1 opt. [1]	1 opt. [1]
Parallel ports	0	optional	optional	optional
Drive bays:
Externally accessible	1 [9]	1 - 5.25”	2 - 5.25” [7]	3 - 5.25” [7]
Internal		1 - 3.50”	1 - 3.50”
	1- 2.50”	1 - 3.50”	2 - 3.50” [8]	3 - 3.50” [8]
# of SATA/eSATA drives	2	3/1	4	5
supported:
MXM 3.0 slot?	Yes	No	No	No
PCIe slots:		(all low profile)	(all full height)	(all full height)
2.0 x16 (graphics)		1 [2]	1 [4]	1 [4]
2.0 x4 (x16 connector)		1 [2]	1 [5]	1 [5]
2.0 x1 connector		1 [3]	1 [6]	1 [6]
1.2 Mini Card	1	0	0	0
PCI 2.3 32-bit 5-V slot,		1	1 full-height	3 full-height
25-watt maximum
Power Supply Unit:
Module type	external	internal	internal	internal
Power rating	135- or180-watt	240-watt	320-watt	320-watt

NOTES:

[1]2nd serial port requires optional cable/bracket assembly.

[2]Low-profile, 25 W maximum.

[3]Low profile, 10-watt maximum

[4]Full-length;

75-watt maximum if PCIe x4 slot is not populated, 35-watt maximum if PCIe x4 slot is populated

[5]35-watt maximum

[6]Half-height, half-length, 10-watt maximum

[7]3.5” devices supported with adapters

[8]2.5” solid state drives supprted with adapter brackets

[9]Slimline bay

Technical Reference Guide www.hp.com 2-3