HP 8200 tower manual Processor/Memory Subsystem Architecture

3

Processor/Memory Subsystem

3.1Introduction

This systems provide an LGA 1155 (H2) socket supporting an Intel Celeron, Pentium Dual-Core, Core i3, Core i5, or Core i7 processor. These processors include an integrated dual-channel DDR3 memory controller (Figure 3-1) and support PC3-8500 and PC3-10600 memory modules. This chapter describes the processor/memory subsystem.

			XMM1		XMM2
			DIMM		DIMM [2]
				or
			SODIMM [1]
		Channel B
Intel	DDR3
	SDRAM	Channel A
Processor
	Cntlr

			DIMM	DIMM [2]
			or
FDI		DMI	SODIMM [1]
			XMM3	XMM4
	PCH

NOTES:

[1]USDT uses SODIMM sockets

[2]CMT, MT, and SFF only

Figure 3-1. Processor/Memory Subsystem Architecture

This chapter includes the following topics:

■Intel processor(3.2)

■Memory subsystem (3.3)

Technical Reference Guide www.hp.com 3-1