HP Z600 manual Restricted Material, Usage, Packaging

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QuickSpecs

HP Z600 Workstation

System Technical Specifications

 

EU Directive 98/ 101/ EEC

 

Batteries used in the product do not contain:

 

Mercury greater than 5ppm by weight

 

Cadmium greater than 10ppm by weight

 

Lead greater than 4000ppm by weight

 

Battery size: CR2032 (coin cell)

 

Battery type: Lithium

Restricted Material

This product does not contain any of the following substances in excess of regulatory limits (refer

Usage

to the HP General Specification for the Environment at

 

http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):

 

Asbestos

 

Batteries – Mercury

 

Batteries – Cadmium

 

Batteries – Lead (non-rechargeable)

 

Batteries – Non-rechargeable Alkaline and Carbon-Zinc Batteries

 

Batteries – Classification as "Not Restricted" for Transport

 

Brominated Flame Retardants (PBBs, PBDEs, including DecaBDE)

 

Brominated Flame Retardants (all BFRs in external case plastic parts)

 

Cadmium and its compounds

 

Certain Azo Colorants

 

Chlorinated Hydrocarbons

 

Chlorinated Paraffins

 

Formaldehyde

 

Formaldehyde – emissions

 

Hexavalent Chromium and its compounds in metallic applications

 

Hexavalent Chromium and its compounds in non-metallic applications

 

Lead and its compounds

 

Lead in paint

 

Lead in Polyvinyl Chloride (PVC) coating of external cables, wires and cords

 

Mercury and its compounds

 

Nickel on external surfaces

 

Ozone Depleting Substances (ODS)

 

Polycyclic Aromatic Hydrocarbons (PAH)

 

Perfluorooctane sulfonates (PFOS) in parts

 

Perfluorooctane sulfonates (PFOS) in preparations

 

Polychlorinated Biphenyls (PCBs) and Polychlorinated Terphenyls (PCTs)

 

Polychlorinated Naphthalenes

 

Polyvinyl Chloride (PVC) in external case plastic parts

 

Radioactive Substances

 

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging

HP Workstation product packaging meets the following (refer to the HP General Specification for

 

the Environment at

 

http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html:

 

Does not contain restricted substances listed in HP Standard 011-1 General Specification

 

for the Environment (see link above).

 

Does not contain ozone-depleting substances (ODS).

 

Design packaging materials for ease of disassembly.

 

Does not contain heavy metals (lead, mercury, cadmium or hexavalent chromium) in excess

 

of 100 ppm sum total for all heavy metals listed.

 

 

 

 

DA - 13277 Worldwide QuickSpecs — Version 23 — 12/1/2010

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Contents Overview QuickSpecsAvailable Processors Form FactorCompatible Operating SystemsDisclaimers Available ProcessorAdditional Details Power Supply Chassis DimensionsSystem Weight TemperatureQuickSpecs Supported Components HP Solid State Drive for Workstations Sata Serial ATA Hard Drives for HP WorkstationsLSI MegaRAID SAS 8888ELP Host Bus Adapter HBA Factory integrated RAID on motherboard for Sata drivesLSI 3041E 4-Port SAS 3.0 Gb/s RAID Card EH417AAMemory Entry 3DMid-range 3D High End 3DPC3-10600 DDR3-1333 ECC Registered DIMMs CTO RAM 1-CPUCPU RAM 2-CPUPC3-10600 DDR3-1333 ECC Unbuffered DIMMs AMO AMOPC3-10600 DDR3-1333 ECC Registered DIMMs AMO HP DX115 Removable Drive Enclosure Monitors Option Factory Kit Part Support Configured Number NB896AA EY703AAGW405AA ED707AAOnly Software Option Factory Kit Part Support Configured NumberNvidia Operating Systems Support Notes System Technical Specifications Sata Panel/Speaker Header Cmos Battery Holder Sata ConnectorsIeee 1394 Connectors Front Rear Internal USB Connectors FrontLED Energy StarTPM QuickSpecs QuickSpecs QuickSpecs Deskside Sound Pressure System Configuration Processor InfoEnvironmental Temperature Declared NoisePhysical Security and Serviceability Standard Format Cooling Solutions Diagnostic LED Power ButtonPower LED ROM Flash Recovery OS CD Restore OS CDBBS SmbiosSPI ROM AtapiASF AcpiPMM EDDEhci PCIUsage Restricted MaterialPackaging Upgrading Service, SupportWarranty LongevityProcessor TitleBase Unit Localization UnitStable & Consistent Offerings Operating Systems Product # Offering Input Devices Product # OfferingFX596AV FY931AVProcessors Technical Specifications ProcessorsDDR3 1066MHz, HT, Turbo 300GB SAS Technical Specifications Hard Drives600GB SAS HDDHeight 2.54 cm Rpm SFF Width Media Diameter 6.36 cm Frame 146GB SAS 15K rpm 3Gb/sSata Serial ATA Hard600GB Capacity Drives for HP Sata 10KPhysical Size 10.17 cm 160GB Sata 10K rpm SFF in 3.5 FrameInterface Synchronous Transfer 1000GB Capacity 1TB Sata Height 7200 rpm 3.0Gb/s 3.5 WidthHDD Width Interface Synchronous Transfer Sata 7200 Height rpm 3Gb/sMedia Diameter 8.9 cm Physical Size 10.17 cm HP 64GB SSDSata SLC Technical Specifications Hard Drive Controllers Technical Specifications Graphics Nvidia NVS 300 512MB Form Factor Image Quality Features Display Output450 512 MB PCIe Graphics Card Bus TypeProgrammable Video 290 256 MB PCIe Bus TypeGraphics Card Memory RamdacProcessor Cores High-ResolutionAntiAliasing Cuda ParallelATI FirePro Form Factor Cuda Parallel Processor Cores Power consumptionHigh-level Shader Languages512MB Graphics Card Graphics Controller GB GDDR3 Cores Power consumptionNvidia Quadro Form Factor 1GB Graphics Card1GB GDDR5 Sdram Image Quality FeaturesATI FirePro V3800 512MB Graphics Card Form Factor MB DDR3 SdramLinux, and up to two displays on XP 1800 768MB Graphics Graphics Controller GB GDDR5 Nvidia Quadro 2000 Form FactorATI FirePro V5700 512MB Graphics Card Form Factor Power consumption 56 Watts1GB GDDR5 Sdram ATI FirePro V5800 1GB Form FactorCard Graphics Controller 3800 1.0GB GraphicsNvidia Quadro 4000 Form Factor ATI FirePro V7750 1.0GB Graphics Card Form Factor2GB Graphics Card Antialiasing Parallel Processor 5GB Graphics Card Processor Cores Power consumptionNvidia Quadro FX 4800 1.5GB PCIe Graphics Card Form Factor Nvidia Quadro 5000 Form FactorNvidia Quadro 5000 Graphics Card Technical Specifications Multimedia and Audio Devices Recording sampling Support Signal-to-Noise RatioConversion of digital Sources Conversion of stereo Digital sources Bit to 24-bitUSA EMCSystem requirements Frequency Response 0Hz to 46kHzHeadphone Connections FlexijackDVD-ROM Technical Specifications Optical and Removable StorageMaximum Data CD ROM Read HP DVD+/-RW Drive DescriptionMounting Orientation Disc FormatsCD-ROM Kit ContentsBlu-ray Transfer Rates DVD ROM ReadRequirements DC Current HP Blu-Ray Writer DescriptionBD-ROM DL DVD+R SL/DLCD-ROM BD-ROMSdhc DisclaimerHP 22-in-1 Media Card Description ReaderQuickSpecs Technical Specifications Controller Cards Temperature 50 to 131 F 10 to 55 C Operating HP Ieee 1394b FireWire PCIe Card Data Transfer RateTechnical Specifications Networking and Communications HP NC360T PCI WOL , PXE, DMI, WFM Intel Gigabit CT Desktop NIC Connector