HP DX2300 manual Technical Specifications Communications

Intel PRO/1000 PT PCIe Connector

RJ-45

Gigabit NIC

Controller

Intel 82572EI Gigabit Ethernet Controller

Memory

Integrated Dual 48K configurable transmit receive FIFO Buffers

Data rates supported

10/100/1000 Mbps

Compliance

IEEE 802.1P, 802,1Q, 802.2, 802.3, 802.3AB and 802.3u compliant,

802.3x flow control

Bus architecture

PCI Express 1.0a

Data transfer mode

Bus-master DMA

Hardware certifications FCC, B, CE, TUV- cTUVus Mark Canada and United States, TUV- GS

Mark for European Union

Power requirement

Aux 3.3V, 3.0 Watts in 1000base-T and 2.0 Watts in 100Base-T

Boot ROM support

Yes

Network transfer rate

10BASE-T (half-duplex) 10 Mbps

10BASE-T (full-duplex) 20 Mbps

100BASE-TX (half-duplex) 100 Mbps

100BASE-TX (full-duplex) 200 Mbps

1000BASE-T (full-duplex) 2000 Mbps (actual rate limited by PCI Bus)

Environmental

Operating temperature

32° to 131°F (0° to 55° C)

Operating humidity

85% at 131° F (55° C)

Dimensions

6.4 x 2.6 x 0.8 in (16.3 x 6.6 x 1.9 cm)

Management

ASF, WOL, PXE, DMI, WFM 2.0.

capabilities

HP Wireless A+G PCI Dimensions

4.99 x 2.54 x 0.71 in (126.8 x 64.4 x 18.0 mm)

Weight

0.268 lb (65 g)

Controller

Atheros AR5414X chipset

system interface

PCI Spec 2.2

Network standard

IEEE 802.11a/b/g

Frequency band

5.1500 to 5.8500 GHz

2.4000 to 2.4835 GHz

2.4465 to 2.4835 GHz (Europe, Middle East, Asia and Asia Pacific –

excluding Japan)

2.4000 to 2.4697 GHz (Japan)

Operating temperature

32° to 140° F (0° to 60° C), operating

Storage temperature

-4° to 176° F (-20° to 80° C), non-operating

Humidity

10% to 85% non-condensing

Operating voltage

5V ± 5%

Power consumption

Tx/Rx peak 560/250mA @ 3.3V (max.)

Output power

15 dBM ±2dB

(approximately)

Receive sensitivity

-90dBm at 11 Mbps (typical)

Data transfer rate

Standard rates of 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 48, 54 and Super AG

Mode108-Mbps

DA - 12668 Worldwide — Version 9 — July 2, 2007

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