HP DX2300 manual Packaging, End-of-life, Management Recycling

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QuickSpecs

HP Compaq dx2300 Microtower Business PC

Technical Specifications - Environmental Data

 

Radioactive Substances

 

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging

HP follows these guidelines to decrease the environmental impact of product packaging:

 

Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in

 

packaging materials.

 

Eliminate the use of ozone-depleting substances (ODS) in packaging materials.

 

Design packaging materials for ease of disassembly.

 

Maximize the use of post-consumer recycled content materials in packaging materials.

 

Use readily recyclable packaging materials such as paper and corrugated materials.

 

Reduce size and weight of packages to improve transportation fuel efficiency.

 

Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

End-of-life

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic

Management and

areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest

Recycling

HP sales office. Products returned to HP will be recycled, recovered or disposed of in a

 

responsible manner.

Hewlett-Packard

Corporate

Environmental

Information

For more information about HP's commitment to the environment:

Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.htmlEco-label certifications http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html

© Copyright 2007 Hewlett-Packard Development Company, L.P. All rights reserved.

The information contained herein is subject to change without notice.

Intel and Pentium are U.S. registered trademarks of Intel Corporation. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

DA - 12668 Worldwide — Version 9 — July 2, 2007

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Contents Microtower OverviewQuickSpecs Standard Features and Configurable Components Hard Drives Application SoftwareSystem Memory StorageMouse One of the following Input Devices Keyboard One of the followingAudio CommunicationPCI System DetailsCooling Solutions FeaturesPower Supply Temperature Range OperatingBios PWMLOM Gigabit PCIe Adapter Features Network Connection FeaturesWireless Power ConservationShock Altitude OperatingVibration Acoustic NoiseAfter-Market Options Optical Drives Accessories Monitors CRTsTFTs GSA MonitorsMemory Optional Memory UpgradesDDR Synch Dram NON-ECC Memory Standard MemoryDrive Support StorageTechnical Specifications Audio Technical Specifications Communications Error Correction Fax Mode CapabilitiesData Compression Power Management UpgradeabilityEMC Ramdac Technical Specifications GraphicsBoard configuration Specification Description Display max resolutionCore power Option kit contentsOption Kit #DL139A Technical Specifications Input Devices ESDEMI RFI EMI-RFI Technical Specifications Hard Drives 250 GB Capacity Technical Specifications Optical Storage Access times Random Weight max Lb 1.2 kg Write speedsTypical reads, including Setting Full Stroke Sata CD-RW/DVD- ROM Combo Drive HeightSata DVD+/-RW LightScribe Drive Height Technical Specifications Removable Storage Environmental Operational Mechanical LengthExtremes Storage environmentalTechnical Specifications Environmental Data Material Usage RoHS ComplianceEnd-of-life PackagingManagement Recycling Hewlett-Packard Corporate Environmental Information
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