HP DX2300 manual Technical Specifications Input Devices, Esd, Emi Rfi

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QuickSpecs

HP Compaq dx2300 Microtower Business PC

Technical Specifications - Input Devices

HP PS/2 or USB

Physical

Keys

104, 105, 106, 107, 109 layout (depending

Standard Keyboard

characteristics

 

upon country)

 

 

Dimensions (L x W x H)

18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)

 

 

Weight

2 lb (0.9 kg) minimum

 

Electrical

Operating voltage

+ 5VDC ± 5%

 

 

Power consumption

50-mA maximum (with three LEDs ON)

 

 

ESD

CE level 4, 15-kV air discharge

 

 

EMI – RFI

Conforms to FCC rules for a Class B

 

 

 

computing device

 

 

MicrosoftPC 99 – 2001

Functionally compliant

 

Mechanical

Languages

38 available

 

 

Keycaps

Low-profile design

 

 

Switch actuation

55-g nominal peak force with tactile feedback

 

 

Switch life

20 million keystrokes (using Hasco modified

 

 

 

tester)

 

 

Switch type

Contamination-resistant switch membrane

 

 

Key-leveling

For all double-wide and greater-length keys

 

 

mechanisms

 

 

 

Cable length

6 ft (1.8 m)

 

 

Microsoft PC 99 – 2001

Mechanically compliant

 

 

Acoustics

43-dBA maximum sound pressure level

 

Environmental

Operating temperature

50° to 122° F (10° to 50° C)

 

 

Non-operating

-22° to 140° F (-30° to 60° C)

 

 

temperature

 

 

 

Operating humidity

10% to 90% (non-condensing at ambient)

 

 

Non-operating humidity

20% to 80% (non-condensing at ambient)

 

 

Operating shock

40 g, six surfaces

 

 

Non-operating shock

80 g, six surfaces

 

 

Operating vibration

2-g peak acceleration

 

 

Non-operating

4-g peak acceleration

 

 

vibration

 

 

 

Drop (out of box)

26 in (66 cm) on carpet, six-drop sequence

 

 

Drop (in box)

42 in (107 cm) on concrete, 16-drop

 

 

 

sequence

 

Approvals

UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

 

Ergonomic compliance

ANSI HFS 100, ISO 9241-4, and TUVGS

 

 

 

 

DA - 12668 Worldwide — Version 9 — July 2, 2007

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Contents Overview MicrotowerQuickSpecs Standard Features and Configurable Components System Memory Application SoftwareHard Drives StorageAudio Input Devices Keyboard One of the followingMouse One of the following CommunicationSystem Details PCIPower Supply FeaturesCooling Solutions Temperature Range OperatingPWM BiosLOM Wireless Network Connection FeaturesGigabit PCIe Adapter Features Power ConservationVibration Altitude OperatingShock Acoustic NoiseAfter-Market Options TFTs Accessories Monitors CRTsOptical Drives GSA MonitorsDDR Synch Dram NON-ECC Memory Optional Memory UpgradesMemory Standard MemoryStorage Drive SupportTechnical Specifications Audio Technical Specifications Communications Data Compression Power Management Fax Mode CapabilitiesError Correction UpgradeabilityEMC Technical Specifications Graphics RamdacCore power Display max resolutionBoard configuration Specification Description Option kit contentsOption Kit #DL139A ESD Technical Specifications Input DevicesEMI RFI EMI-RFI Technical Specifications Hard Drives 250 GB Capacity Technical Specifications Optical Storage Typical reads, including Setting Full Stroke Weight max Lb 1.2 kg Write speedsAccess times Random Sata CD-RW/DVD- ROM Combo Drive HeightSata DVD+/-RW LightScribe Drive Height Technical Specifications Removable Storage Extremes Mechanical LengthEnvironmental Operational Storage environmentalTechnical Specifications Environmental Data RoHS Compliance Material UsageManagement Recycling PackagingEnd-of-life Hewlett-Packard Corporate Environmental Information
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