PCB Inspection, Procedure | Samsung MH026FNCA specs

9-4 PCB Inspection

9-4-1 Cautions for Part Replacement

1.The human body carries much static electricity. Before touching a part for repair, replacement or the similar purpose, be sure to touch a grounded metal lic portion by hand to let the static electricity go through the metallic portion to the earth.

Especially when handling any micro computer or IC, carefully remove such static electricity before touch ing them.

2.When repairing any part on a work bench, be sure to place an insulative sheet on the bench and always keep the sheet surface neat without any metal frag ments. If any such fragment touches a part, a sec ondary trouble will possibly be caused in the part.

3.Before replacing any parts, be sure to turn off the power supply. If such replacement is done with the power supply kept on, an electric shock, short circuit or destruction of a part may result.

4.During replacement or repair of a part, carefully han dle it : The printed circuit board has fine lead wires (jumper wires) and glass-made parts (diode) on its substrate.

So if a circuit board is roughly handled, such lead wires and parts will be easily broken or damaged by bending or shock.

5.When soldering the lead wires of any new part, be sure to polish them using an emery paper or the like before soldering them.

Since the lead wires of any new part are covered with an oxide film, solder cannot adhere to the lead wires if not polished.

9-4-2 Procedure

12-4-2The parts should be replaced in the following procedure.

Check for any faulty part.

Detach the faulty part.

Replace it with a new part.

Check the operation of the new part.

The repair is completed.

6.When soldering any part, care should be exercised not to apply any high-wattage soldering iron to the part for a long time. Some parts are of so low a heat resistance that they may be broken or have the properties changed if a soldering iron is so applied (Otherwise, the pattern may possibly be separated and raised).

7.The heat of the soldering iron should be transferred to the entire object to be soldered. If the solder pieces are not well fused due to insufficient transfer of the heat from the soldering iron, no satisfactory electrical continuity can be assured even if the sol dered objects appear well connected to each other.

8.The solder used should be limited to a minimum.

If excessive solder is used, it will cause inter-pattern contact, which may cause malfunction of the circuit.

9.Although some part of the PCB surface are coated with coating material for protection from dust and dirt, soldering is also available to the coating part. Because this coating is thin and is weak for solder ing heat.

But coating material remaining on the solder part should be cleaned up before soldering a new component to prevent the solder part from becoming bad conduction.

Samsung Electronics

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MH026FNCA specifications

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