Component Replacement

REMOVING & REPLACING THE DAUGH- TER BOARDS

The Daughter Boards are soldered into the Main Board Assy.

1.Remove the Main Board (Refer to Removing & Replacing the Main Board).

2.Unsolder the appropriate Daughter Board from the Main Board Assembly.

To Replace a Daughter Board:

1.Ensure that the Main Board Assembly and Daugh- ter Board are mechanically clean.

2.Insert the daughter board in the required position.

3.Ensure the Daughter Board is properly seated in the Main Board Assembly.

4.Solder the Daughter Board into position.

zCAUTION: To avoid damage to the Main Board Assembly, soldering must be accomplished quickly. Refer to Component Replacement section of manual located on this page.

REMOVING & REPLACING THE SPEAKER

To remove the speaker:

1.Remove the Main Board (Refer to Removing & Replacing the Main Board).

2.Unscrew the two speaker mounting bracket screws from the chassis.

3.Desolder the two pin wire harness from the speaker.

4.Remove the speaker.

To replace the speaker

1. Reverse the steps taken to remove the speaker.

MAXON

SP-300 HAND HELD

Surface Mount Components

Surface mount components should always be replaced using a temperature controlled soldering system. The soldering tools may be either a temperature controlled soldering iron or a temperature controlled hot-air soldering station. A hot- air system is recommended for the removal of components on these boards. With either soldering system, a temperature of 700° F (371° C) should be maintained.

The following procedures outline the removal and replace- ment of surface mount components. If a hot-air soldering system is employed, see the manufacturer’s operating instructions for detailed information on the use of your sys- tem.

zCAUTION: Avoid applying heat to the body of any surface mount component using standard soldering methods. Heat should be applied only to the metal- ized terminals of the components. Hot-air systems do not damage the components since the heat is quickly and evenly distributed to the external sur- face of the component.

zCAUTION: The CMOS Integrated Circuit devices used in this equipment can be destroyed by static discharges. Before handling one of these devices, service technicians should discharge themselves by touching the case of a bench test instrument that has a 3-prong power cord connected to an outlet with a known good earth ground. When soldering or des- oldering a CMOS device, the soldering equipment should have a known good earth ground.

Surface Mount Removal

1.Grip the component with tweezers or small needle nose pliers.

2.Alternately heat the metalized terminal ends of the surface mount component with the soldering iron. If a hot-air system is used, direct the heat to the ter- minals of the component. Use extreme care with the soldering equipment to prevent damage to the printed circuit board (PCB) and the surrounding components.

3.When the solder on all terminals is liquefied, gently remove the component. Excessive force may cause the PCB pads to separate from the board if all sol- der is not completely liquefied.

Page -19- May 2001