AG Neovo TSC-30/IC

TSC-30/IC Product S

ecification

Vcc=

4.0 to 5.25V 2.1 60 mA

Icc1

Normal

mode

*1 Vcc=

3.0 to 4.0V 35 mA

Icc2 STOP mode

Vcc=

3.0 to 5.25V 2.0 mA

Vcc=

4.0 to 5.25V 125.0 250 uA

Power supply current

Icc3

At USB

suspend

mode*3 Vcc=

3.0 to 5.25V 0.1 uA

*1: All USB difference-input circuits enabled. Le aving I/O pins open. Operating functions: CPU, Timers

*2: All USB difference-input circuits enabled. Leaving I/O pins open. Operating functions: Timers, USB

receiving. Disabled functions: CPU.

*3: All USB difference-input circuits disabled. Leaving I/O pins open. Oscillation stopped.

Contents

Main Table of Contents 1. Products outline 1-1. Scope of Application 1-2. Outline 1-3. Features 1-4. General specification 2. Pin layout and representation INDEX Marking specification TSC-30x XXX ###### 3. Pin functions Page 4. Initial setting 4-1. EEPROM setting 4-2. Communication mode setting 4-3. Touch screen mode setting 4-4. Configuration in USB mode 4-5. Panel ID setting (USB mode) Host TSC-30/IC End Point 0 IN/OUT Buffer Control transfer 5. Data sheet 5-1. Absolute maximum rating Document No. DER-S0008A 10 Version 1.0 2008 DMC Co., Ltd. 5-2. Recommended operational conditions Page 5-3. Timing requirement RESET 0.2Vcc w 0.8Vcc 0.8Vcc 0.2Vcc Page Document No. DER-S0008A 14 Version 1.0 2008 DMC Co., Ltd. 5-4. DC standards (Vcc=3.00 to 5.25V, Vss=0V, Ta=-20 to 85C, unless otherwise noted) Page 6. Packaging Specification 6-1. Outline 6-2. Notes on storage/handling 6-3. Basic packaging 6-4. Small group packaging 6-5. Tray specification 6-6. Product name label specification 7. Storage Specification 7-1. Storage Conditions 7-2. Baking 8. Implementation Temperature Specification 1. Reflow method (Infrared reflow, air reflow) 2. Soldering iron (Manual soldering) 9. Terminal Pin Specification 10. Cleaning 11.Changes and improvements 11-1. Version history 12. Warranty 12-1. Warranty Period 12-2. Warranty Target 12-3. Warranty Exceptions 13. Notes on use 13-1. Overall handling 13-2. Others