AG Neovo TSC-30/IC Implementation Temperature Specification, Soldering iron Manual soldering

TSC-30/IC Product Specification

8. Implementation Temperature Specification

We do not recommend the wave soldering method.

1. Reflow method (Infrared reflow, air reflow)

Frequency:	Three times or less
Temperature:	The following device surface temperature profile is recommended.

Package’s surface temperature

175±10 °C

260 °C max.

255 °C or higher, 10s max.

220 °C or higher, 50s max. 200 °C or higher, 70s max.

1 to 4 °C/s

110±20s

Time

Figure 1: Infrared reflow, air reflow temperature profile

2. Soldering iron (Manual soldering)

Soldering bit’s temperature:		370 °C or lower
Soldering time:	Five seconds or less/terminal

Document No. DER-S0008A 20 Version 1.0 ©2008 DMC Co., Ltd.