Asus P7P55-M manual 27

DDR3 1333 MHz capability

			SS/			Timing			DIMM
								Support
Vendor	Part No.	Size		Brand	Chip NO.	DIMM	Voltage
			DS
						(BIOS)		A*	B*	C*
Crucial	BL25664ABA1336.16SFB1	4096MB(Kit of 2)	DS	N/A	Heat-Sink Package	6-6-6-20	1.8V	•	•
Crucial	BL25664BA1336.16SFB1	4096MB(Kit of 2)	DS	N/A	Heat-Sink Package	6-6-6-20	1.8V	•	•	•
Crucial	BL25664BN1337.16FF	6144MB(Kit of 3 )	DS	N/A	Heat-Sink Package	7-7-7-24	1.65V	•	•	•
	(XMP)
Crucial	CT25664BA1339.16SFD	6144MB(Kit of 3 )	DS	Micron	8UD22D9JNM	9		•	•
G.SKILL	F3-10600CL8D-2GBHK	1024MB	SS	G.SKILL	Heat-Sink Package			•	•	•
G.SKILL	F3-10600CL9D-2GBPK	1024MB	SS	G.SKILL	Heat-Sink Package			•	•	•
G.SKILL	F3-10666CL7T-3GBPK	3072MB(Kit of 3)	SS	N/A	Heat-Sink Package	7-7-7-18	1.5~1.6V	•	•
G.SKILL	F3-10666CL9T-3GBNQ	3072MB(Kit of 3)	SS	N/A	Heat-Sink Package	9-9-9-24	1.5~1.6V	•	•	•
G.SKILL	F3-10600CL7D-2GBPI	1024MB	DS	G.SKILL	Heat-Sink Package			•	•	•
G.SKILL	F3-10600CL9D-2GBNQ	1024MB	DS	G.SKILL	Heat-Sink Package			•	•	•
G.SkiLL	F3-10666CL8D-4GBHK	4096MB(Kit of 2 )	DS	N/A	Heat-Sink Package	8-8-8-21	1.5-1.6V	•	•	•
G.SKILL	F3-10666CL7T-6GBPK	6144MB(Kit of 3 )	DS	N/A	Heat-Sink Package	7-7-7-18	1.5~1.6V	•	•	•
G.SKILL	F3-10666CL9T-6GBNQ	6144MB(Kit of 3)	DS	N/A	Heat-Sink Package	9-9-9-24 1.5V~1.6V		•	•	•
GEIL	DDR3-1333 CL9-9-9-24	1024MB	SS	N/A	Heat-Sink Package	9		•	•	•
GEIL	GV34GB1333C7DC	2048MB	DS	N/A	Heat-Sink Package	7-7-7-24	1.5V	•	•	•
GEIL	GG34GB1333C9DC	4096MB(Kit of 2)	DS	GEIL	GL1L128M88BA12N	9-9-9-24 1.3V(low		•	•	•
							voltage)
GEIL	DDR3-1333 CL9-9-9-24	6144MB(Kit of 3 )	DS	N/A	Heat-Sink Package	9	1.5V	•	•	•
Kingmax	FLFD45F-B8MF9	1024MB	SS	Micron	8HD22D9JNM			•	•
Kingmax	FLFD45F-B8MH9 MAES	1024MB	SS	Micron	9CF22D9KPT			•	•	•
Kingmax	FLFE85F-B8MF9	2048MB	DS	Micron	8HD22D9JNM			•	•
Kingmax	FLFE85F-B8MH9 MEES	2048MB	DS	Micron	9GF27D9KPT			•	•	•
Kingston	KVR1333D3N9/1G	1024MB	SS	Hynix	H5TQ1G83BFR	9	1.5V	•	•	•
Kingston	KVR1333D3N9/2G	2048MB	DS	Qimonda	IDSH1G-03A1F1C-13H		1.5V	•	•	•
Micron	MT8JTF12864AY-1G4D1	1024MB	SS	Micron	8LD22D9JNM			•	•	•
Micron	MT8JTF12864AZ-1G4F1	1024MB	SS	Micron	9FF22D9KPT	9		•	•	•
Micron	MT9JSF 12872AZ-1G4F1	1024MB	SS	Micron	91F22D9KPT(ECC)	9		•	•	•
Micron	MT8JTF12864AY-1G4D1	3072MB(Kit of 3)	SS	Micron	8XD22D9JNM	9		•	•	•
Micron	MT12JSF25672AZ-1G4F1	2048MB	DS	Micron	91F22D9KPT(ECC)	9		•	•	•
Micron	MT16JTF25664AY-1G1D1	2048MB	DS	Micron	8LD22 D9JNM			•	•
Micron	MT18JTF25664AZ-1G4F1	2048MB	DS	Micron	9KF27D9KPT	9		•	•	•
Micron	MT16JTF25664AY-1G4D1	6144MB(Kit of 3)	DS	Micron	8UD22D9JNM	9		•	•
OCZ	OCZ3P13332GK	2048MB(Kit of 2)	SS	N/A	Heat-Sink Package	7-7-7-20 1.8V		•	•
OCZ	OCZ3X1333LV3GK(XMP)	3072MB(Kit of 3)	SS	N/A	Heat-Sink Package		1.6V	•	•
OCZ	OCZ3G13334GK	4096MB(Kit of 2)	DS	N/A	Heat-Sink Package		1.7V	•	•	•
OCZ	OCZ3RPX1333EB4GK	4096MB(Kit of 2)	DS	N/A	Heat-Sink Package	6-5-5-20 1.85V		•	•	•
OCZ	OCZ3X13334GK(XMP)	4096MB(Kit of 2)	DS	N/A	Heat-Sink Package		1.75V	•	•	•
OCZ	OCZ3G1333LV6GK	6144MB(Kit of 3 )	DS	N/A	Heat-Sink Package	9-9-9-20	1.65V	•	•	•
OCZ	OCZ3P1333LV6GK	6144MB(Kit of 3 )	DS	N/A	Heat-Sink Package	7-7-7-20	1.65V	•	•	•
OCZ	OCZ3X1333LV6GK(XMP)	6144MB(Kit of 3 )	DS	N/A	Heat-Sink Package	8-8-8-20	1.60V	•	•	•
SAMSUNG	M378B2873DZ1-CH9	1024MB	SS	Samsung	K4B1G0846D-HCH9			•	•	•
SAMSUNG	M378B2873DZ1-CH9	1024MB	SS	Samsung	SEC 846 HCH9 K4B1G08460			•	•	•
SAMSUNG	M378B2873EH1-CH9	1024MB	SS	Samsung	SEC 913 HCH9 K4B1G0846E			•	•	•
SAMSUNG	M391B2873DZ1-CH9	1024MB	SS	Samsung	K4B1G0846D-HCH9(ECC)			•	•	•
SAMSUNG	M378B5673DZ1-CH9	2048MB	DS	Samsung	K4B1G0846D-HCH9			•	•	•
SAMSUNG	M378B5673EH1-CH9	2048MB	DS	Samsung	SEC 913 HCH9 K4B1G0846E			•	•	•

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ASUS P7P55-M 1-17