Operating Environment Specification

DIGITAL-LOGIC AG		SMX945 Condensed Manual V1.0A

Physical Characteristics	Specification
Dimensions	Length:	117 mm +/- 0.1mm
	Depth:	70 mm +/- 0.1mm
	Height:	15 mm +/- 0.2mm (with 5mm bus connectors)
		18 mm +/- 0.2mm (with 8mm bus connectors)
	The connector height is selected by the connector on the carrier board.
Weight	120 gr / 12 ounces
PCB Thickness	1.6 mm / 0.0625 inches nominal
PCB Layer	Multilayer

Operating Environment	Specification
Relative Humidity	5-90% non-condensing
Vibration	5 to 2000 Hz
Shock	10 G
Operating Temperature	Standard: T.B.D. (depends on the CPU and the cooling concept)
	Extended Range: T.B.D.
Maximum Copper Temperature	90°C
Storage Temperature	-55°C to +85°C

EMI / EMC (IEC1131-2 refer MIL 461/462)

ESD Electro Static Discharge	IEC 801-2, EN55101-2, VDE 0843/0847 Part 2
	Metallic protection needed
	Separate Ground Layer included
	15 kV single peak
REF Radiated Electromagnetic Field	IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9.
	Not tested
EFT Electric Fast Transient (Burst)	IEC 801-4, EN50082-1, VDE 0843 Part 4
	250V - 4kV, 50 ohms, Ts=5ns
	Grade 2: 1KV Supply, 500 I/O, 5Khz
SIR Surge Immunity Requirements	IEC 801-5, IEEE587, VDE 0843 Part 5
	Supply:	2kV, 6 pulse/minute
	I/O:	500V, 2 pulse/minute
	FD, CRT: None
High-Frequency Radiation	EN55022

All information is subject to change without notice.